Participating in the new round of equity-based and convertible debt financing are telecom operator Swisscom and Reliance Technology Ventures, the venture capital arm of Reliance ADA Group of India.

The two companies join private equity firm CDC Enterprises, through the France investment program, as new Sequans minority investors. The investment bank NATIXIS is the primary participant in the convertible debt financing.

The funding announcement was made at Mobile World Congress in Barcelona. In addition, Sequans revealed that Mitsumi, a manufacturer of multi-chip and system-in-package modules, is using Sequans chips to manufacture Mobile WiMAX modules.

The first devices Mitsumi will deliver to customers are an SD card based on Sequans' SQN1130 Mobile WiMAX baseband chip and an SDIO module based on Sequans' SQN1130 baseband and SQN1140 RF chips.

In still another announcement, Sequans has teamed up with Tecom Co. Ltd., a Taiwan equipment manufacturer, to introduce a WiMAX product series from Tecom, including Mobile WiMAX Wave 2 base stations and subscriber stations using Sequans chip solutions as the main design platform.

On display at Mobile World Congress in Barcelona are pico and femto base station units and several end user devices, including a USB dongle, ExpressCard, desktop CPE (modem and access gateway/IAD), and PCMCIA card.