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ISSCC LogoISSCC
International Solid-State Circuits Conference
February 8-12, 2009
San Francisco Marriott Hotel
San Francisco

EE Times - ISSCC Archive ISSCC Archive
February 2009

  • MIT goes 3-D with image sensor
  • Wireless implants aid medical research
  • Intel developing optical chip-to-chip interconnects
  • Engineers push into 40G networking
  • Panel skeptical on future of MIDs
  • Researcher describes 77-GHz transceiver
  • Implantable drug-delivery SoC shows promise
  • Serdes about to get extreme makeover
  • Intel, NEC show diverging CPU paths
  • Intel lists five challenges for IC scaling

  • IBM Fellow urges engineers to promote the profession
  • Radio chips dial into medical apps
  • Video: Green tech drives ICs beyond silicon
  • IMEC powers ahead with 60GHz building blocks
  • Under the Hood: The race is on for 50-nm DRAM
  • SanDisk, Toshiba tip new x3, x4 NAND
  • Toshiba rolls high-speed, 128-Mbit FeRAM
  • Australian startup claims RRAM breakthrough
  • Three enablers to drive IC innovation
  • Smart sensor targets advanced machine vision

  • Intel says 32 nm on track for late 2009

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