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EUV woes fuel double-patterning race
ASML, Canon and Nikon updated their litho roadmaps. And IMEC and JSR rolled out a new freezing technique in double-patterning lithography.
What's next in ATE shakeout?
The shakeout in the automatic test equipment (ATE) business is over.
SEMI book-to-bill still below parity
The fab-tool market remains bleak, based on various and new data in the industry.
Chips fall where they may in the 'More than Moore' era
The semiconductor industry and the semiconductor tool industry are at a crossroads of going along the path to expand on Moore's Law vs. embracing a "More than Moore" postulate.
Video: EV Group talks 3D, nanoimprint
What are the trends in 3D packaging tools, nanoimprint lithography and other hot markets?
Video: Qcept says startups can survive downturn
Can startups survive the current IC-equipment downturn?
CEA/Leti, Vistec start e-beam cell projection
LETI, the electronics research laboratory that is part of CEA, France's atomic energy commission, has placed another order with Vistec Electron Beam GmbH (Jena, Germany) for a cell projection upgrade of its SB3054 variable-shaped electron beam system, which was delivered at the end of 2007 and installed early this year.
SOI gathers steam
The SOI Industry Consortium said that Nvidia Corp. has joined the organization.
Updated: 450-mm debate remains heated
The 450-mm debate rages on.
Video: AMAT's Stork lists IC scaling challenges
What are the challenges in 3D packaging, lithography, scaling and other subjects in ICs?
Video: Aviza CEO says MEMS are hot
What's hot at Semicon West? 3D packaging, MEMS and solar.
Samsung rumors pour cold water on Semicon
Rumors that Samsung Electronics Co. Ltd. this week pushed out its fab-tool orders sent shock waves at the Semicon West trade show, putting vendors in a somber and gloomy mood.
Solar thermal technology heats up
Solar thermal technology that attempts to harness the efficient phase change from water to steam is emerging as the preferred alternative energy technology in the race to replace fossil fuels with sustainable energy sources, experts agree.
SEMI forecasts equipment declines, seeks U.S. policy reforms
The industry group SEMI is forecasting that the semicondcutor equipment market will decline 20 percent in 2008.
Video: Novellus CEO says no to 450-mm
Richard Hill, chairman and CEO of Novellus, speaks out against the need for the industry to migrate towards 450-mm fabs.
Video: EDA lags in 3D, says Qualcomm exec
EE Times caught up with Jim Clifford, senior vice president and general manager of Qualcomm Inc.'s CDMA Technologies unit.
SEMI: Fab-tool biz to fall 20 percent
The semiconductor-equipment market is projected to hit $34.12 billion in 2008, down 20 percent over 2007, according to SEMI here on Monday (July 14).
IMEC develops thin wafers for silicon solar cells
Research institute IMEC vzw has said it is developing a method to produce 50 micron thick crystalline silicon wafers for use in solar cells.
Qualcomm joins IMEC's 3D group
Qualcomm Inc. has become the first fabless chip maker to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration.
Aviza licenses vertical furnace line
Aviza Technology Inc. has licensed its vertical furnace product line to Expertech Inc., a manufacturer of diffusion and LPCVD furnaces.
Rudolph divests lead scanner assets
Rudolph Technologies Inc. has divested its lead scanner assets and licensed related intellectual property acquired from RVSI Inspection LLC to BKM Technology Partners LLC.
Entegris acquires Poco for $158 million
Entegris Inc. has signed a definitive agreement to acquire Poco Graphite Inc. for $158 million in cash.
Elpida's secret weapon: Intermolecular
How will Japan's Elpida Memory Inc. dig its way out of the DRAM downturn? The DRAM specialist appears to have a new and secret weapon.
Nanoelectrodes boost electrolysis to cut hydrogen fuel cost
QuantumSphere's nanoparticle-coated electrodes boost electrolysis by 300 percent and could enable consumers to refill their hydrogen fuel-cell cars in the garage.
UC claims EUV source breakthrough
A new, cheaper laser light source for extreme ultraviolet (EUV) lithography has been patented by the University of California at San Diego (UCSD) in cooperation with Cymer Inc.
SiGen claims wafering technology advance for PVs
Silicon Genesis (San Jose, Calif.) is claiming a major breakthrough in the production of solar substrates for photovoltaic applications.
Intel invests in CMP pad startup
NexPlanar Corp. has completed a $14.5 million round of funding to commercialize the next-generation of chemical mechanical planarization (CMP) pad technology for semiconductor devices.
Ceradyne buys SemEquip
Ceradyne Inc. has signed a definitive agreement to acquire SemEquip Inc. for approximately $25 million in cash.
Gartner lowers capex forecast
It's official: The IC-equipment market is in a downturn.
GSI acquires Excel for $360 million
GSI Group Inc. has acquired Excel Technology Inc. for $32.00 per share, or approximately $360 million.
Dow buys Rohm and Haas for $15.3 billion
In a blockbuster move within the materials space, Dow Chemical Co. will acquire Rohm and Haas for $15.3 billion in cash.
Solar cell production to benefit chemical, material suppliers, says report
Consumption of chemicals and materials for amorphous silicon solar cell production is expected to reach $240 million in 2008 and $575 million in 2010, according to market research group The Information Network (New Tripoli, PA.).
Sematech: 450-mm is progressing
International Sematech continues to move full speed ahead with its 450-mm programs, but the question is whether the industry can meet its lofty goals in building 450-mm fabs by 2012.
FlexTech Alliance expands display consortium's charter
The U.S. Display Consortium has expanded into the emerging flexible, printed electronics market and changed its name to FlexTech Alliance.
ST uses EVG's 300-mm tools to produce 3D TSV-based devices
European chipmaker STMicroelectronics NV announced it has placed a multi-million euro order of 300-mm bonding, alignment and photoresist processing tools with EV Group (St. Florian, Austria), supplier of wafer-bonding and lithography equipment.
Applied puts Asia hub in Singapore
Applied Materials Inc. has broke ground for the construction of a new operations facility in Singapore.
Applied calls offer for ASMI unit 'full and fair'
Applied Materials Inc. CEO Michael Splinter has reiterated that its offer to buy some operations of ASM International (Bilthoven, the Netherlands) was "full and fair."
Nikon tops ASML for Intel's 32-nm node
In a major change in strategy, Intel Corp. has selected Nikon Corp. over ASML Holding NV for a hotly-contested lithography order for the chip giant's 32-nm node, according to sources.
Updated: ASML, FEI, Teradyne roll new fab tools
Heading into next week's Semicon West trade show in San Francisco, ASML, FEI, TEL, Teradyne and others have jumped the gun and rushed out their new fab tools.
Yole predicts millions of 3D-TSV wafers
French research and strategy consulting company Yole Dveloppement (Lyon, France) provides an analysis on the effect of 3D interconnects using through-silicon vias (TSVs) on the semiconductor manufacturing market as it expects that 3D-TSV wafers will be shipped in millions and impact about 25 percent of the memory business by 2015.
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