STMicroelectronics (Geneva, Switzerland) said EVG's automated tools are installed at its 300-mm through-silicon-via (TSV) pilot line in Crolles, France, and used to produce CMOS imaging sensors.

The company specified that the order is in line with its strategy to accelerate the manufacturing of 3D TSV-based devices into high volume.

EVG claimed its NanoSpray technology provides photoresist coating processing capabilities for steep topographies while its IQ Aligner solution delivers "precise and reliable lithography backside alignment." EVG stated that ST also ordered its EVG150 Coater and EVG150 Developer, which in conjunction with its NanoSpray technology, is said to deliver uniform coats with low material usage and improved repeatability.

In its latest report, French research and strategy consulting company Yole Dveloppement (Lyon, France) said it anticipates that 3D-TSV wafers will be shipped in millions and impact about 25 percent of the memory business by 2015. And, if it excludes memories its analysis indicates that 3D-TSV could represent more than 6 percent of the total semiconductor industry by 2015.