On Wednesday (July 9), chip-making consortium Sematech provided an update on its next-generation 300- and 450-mm programs, saying that they are on track and making steady progress.

The consortium is up and running with its "factory integration test bed" facility for the development of 450-mm fab tools. Sematech (Austin, Texas) is also testing silicon wafers based on 450-mm technology. And the group also claims it has made progress on its so-called ''Next Generation Factory'' (NGF) program. The program is geared to bring lower costs and reduced cycle times in 300-mm wafer manufacturing.

Recently, Sematech unveiled two next-generation fab programs: 300mmPrime and the International Sematech Manufacturing Initiative's ISMI 450mm effort.

There is widespread support among the fab-tool community for 300mmPrime, which looks to boost the efficiency of existing 300-mm fabs, thereby pushing out the need for 450-mm plants.

The newer, more controversial ISMI 450mm program, announced last year at Semicon West, calls for some chip makers to make a more direct transition from 300-mm to the larger 450-mm wafer size.

Many fab-tool vendors are reluctant to endorse the next-generation wafer size or devise 450-mm tools, saying that it is simply too expensive. Many vendors claim that 300-mm fabs are suitable for most applications and the real goal for the industry is to improve the productivity of current plants.

"There is still a lot of concern and debate'' about 450-mm fabs among the equipment makers, said Scott Kramer, vice president of manufacturing at International Sematech, but "the tide has shifted over the last 12 months.''

A few fab-tool and materials vendors have develop 450-mm technologies, but many suppliers have publically slammed Sematech's 450-mm program, saying the economics simply don't add up.

However, the mood is somewhat beginning to change, especially when Intel, Samsung and TSMC in May reached an agreement on the need for industry collaboration for 450-mm wafers starting in 2012. Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and reduce 450-mm research and development costs by applying aligned standards, rationalizing changes from 300-mm infrastructure and automation, and working toward a common timeline.

Intel, Samsung and TSMC represent a major chuck of the world's capital equipment buyers. Because those companies are pushing for 450-mm fabs, it could jumpstart the development of the next-generation wafer size.

Many believe that 450-mm tools will not be ready in the 2012 timeframe. Even Kramer acknowledged that the 2012 timetable for 450-mm fabs is ''very aggressive.''

"Those are risky goals,'' he said.