Under the terms, Qualcomm and IMEC will collaborate on the development of 3D technologies in future wireless products. Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

IMEC's 3D integration program explores three dimensional technology and design for application in various domains.

The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find solutions for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy.

The 3D system-on-chip design research program provides insights to its benefits, costs, challenges and solutions. The program will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.

''We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products,'' said Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies, in a statement.