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Video: EDA lags in 3D, says Qualcomm exec
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EE Times


At the Semicon West trade show here, Mark LaPedus, semiconductor editor from EE Times, caught up with Jim Clifford, senior vice president and general manager of Qualcomm Inc.'s CDMA Technologies unit.

In a video, Clifford outlined his keynote at the event, which talks about the changes in the computer and communications industries. He also discusses the challenges in 3D packaging, saying that the EDA industry is lagging behind in the arena.

Click image below to see video interview.



Related Links:

  • Qualcomm joins IMEC's 3D group



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