EETimes.com - Video: AMAT's Stork lists IC scaling challenges

EE Times: Conference: Semicon West

Video: AMAT's Stork lists IC scaling challenges

Mark LaPedus
EE Times
(07/15/2008 9:22 PM EDT)

SAN FRANCISCO -- What are the challenges in 3D packaging, lithography, scaling and other subjects in ICs?

To get a handle on the challenges, Mark LaPedus, semiconductor editor from EE Times, met with Hans Stork, group vice president and chief technology officer of the Silicon Systems unit of Applied Materials Inc. (Santa Clara, Calif.).

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