The company is highlighting the next generation PrimeCell AMBA 3 AXI configurable interconnect , dubbed the PL 301, at this weeks DAC in San Francisco, together with the AMBA Designer Ecosystem Edition design automation tool.

ARM (Cambridge, England) says together, the package povides designers with the ability to efficiently manage the flow of on-chip traffic for the latest SoC designs, resulting in devices with greatly increased performance and improved power savings.

"The need to make complex SoC design as efficient as possible is an industry-wide issue that ARM, in conjunction with leading semiconductor companies, is addressing with its comprehensive AMBA design protocol," said Jonathan Morris, general manager, Fabric, ARM.

The company says the package also allows system architects to create very simply fully optimized register transfer level (RTL) design files in a SPIRIT-compatible file format. As a result, the AMBA Designer tool in combination with the PrimeCell Configurable Interconnect and peripheral IP can quickly generate a complete Fabric system design package ready for IC implementation and manufacture.

"One of key focus areas for Toshiba is to improve the quality and availability of next-generation consumer electronics through leading-edge innovation, which is why ARM's AMBA protocol-based design solutions are so important," commented Takashi Yoshimori, SoC-Design Technology Executive, Toshiba Corporation Semiconductor Company.