Design Article

EMC Basics #7: An introduction to troubleshooting EMI problems

Daryl Gerke, Kimmel Gerke Associates

6/27/2011 9:36 PM EDT


[Editor's note: we are pleased to continue our series on the vital and sometimes unappreciated topic of electromagnetic compatibility (EMC), presented by well-known expert Daryl Gerke of Kimmel Gerke Associates. Note that there are links to all previous entries at the end of this item.]

Time to switch gears for a while, and look at troubleshooting EMI problems. We'll examine four key EMI problems -- emissions, ESD (electrostatic discharge), RFI (radio frequency interference), and power disturbances. We'll look at these problems in two contexts -- the EMI test lab, and the engineering lab. We'll also discuss specific troubleshooting techniques.

Troubleshooting consists of trying to isolate a problem and the underlying causes, and then applying appropriate fixes. Often times, we are acting like a medical doctor to diagnose an EMI illness.

Diagnosis is important -- don't just start throwing solutions at the problem. The medical profession has a saying for this --"Prescription without diagnosis is malpractice."  I think this applies to EMI problems, too.

To continue with the medical analogy, doctors use a methodology known as differential diagnosis. That means ruling things in, and ruling things out. In simple terms, diagnosis is often a process of elimination. Or at least, a process of playing the odds.

Diagnosis involves several stages: looking at clues, examining the equipment, and perhaps gathering additional information (usually through tests.)

 The first step is to look at the clues. For example:

     • What are the symptoms?  Resets? Lockup? Bizarre readings?

     • How bad is the problem? Small outage? Damage? Catching on fire?

     • Is there an obvious cause and effect? In the test lab, this may be very obvious. In the field, this may be unknown, so you may have to speculate.

     • What are some key parameters?  Frequencies? Amplitudes? Dimensions?  Impedances?

The next step is to examine the equipment. For example:

    • How does the electrical design look? Multilayer or two layer boards? Layout? Etc.?

    • How does the mechanical design look? Metal enclosure or all plastic? Seams? Penetrations?

    • What about cables and connectors? Shielded? Filters?

    • And what about the power interface? Filters? Transient protection?

At this point, one should make a preliminary diagnosis. If the data is still fuzzy, you may need additional testing. The tests can either be monitors, or failure forcers.  Both can provide critical information.

By the way, it is OK to change your diagnosis as you proceed -- doctors do this all the time. More important, don't fall in love with your initial diagnosis, but keep an open mind as new data becomes available.

Once comfortable with a diagnosis, you are finally ready to try fixes (prescriptions.) Install, test, and observe. If nothing happens, try another fix. And so on. Keep notes as you go along so you can backtrack.

By the way -- don't try only one fix at a time, but rather stack them up. To change analogies, EMI problems are often like a leaky boat. If you have five holes in the boat, but you only apply one patch one at a time, you'll never get dry.

A final admonition -- at this stage, don't worry about the practicality of your fixes. The initial goal is to find a fix - any fix. Once you find that first fix, you can always try for a better one.

Over this next series, we'll examine various EMI problems. We'll look at the symptoms, and we'll discuss various troubleshooting tests. We'll also include recommended fixes. Stay tuned...  

 

Previous entries in the series

EMC Basics #1: Welcome!; and Clocks: critical circuits for EMC

EMC Basics #2: Resets as Critical Circuits

EMC Basics #3: Voltage regulators as critical circuits

EMC Basics #4: Analog devices as critical circuits

EMC Basics #5: I/O as critical circuits

EMC Basics #6: Looking at circuit board "stackup"

 

Also relevant to this topic:

Debugging: The 9 Indispensible Rules for Finding Even the Most Elusive Software and Hardware Problems (Chapter 5, Part 3 of 3) (and see its preceding sections, which are linked within)

 

About the author

Daryl Gerke, an EMI/EMC consultant since 1987, along with business partner Bill Kimmel, focuses on design and troubleshooting (not test and regulations). He and Kimmel have been chasing EMI problems for over 80 years (combined, of course.) He is a published author and columnist, and their EDN Designer's Guide to EMC (1994) is still in relevant and in demand. He can be reached via http://www.emiguru.com or his other blog at http://www.jumptoconsulting.com/.






Luis Sanchez

6/28/2011 4:51 PM EDT

"don't worry about the practicality of the fix", this reminds me of once that I was witness of a fix which involved a strange looking plastified sheet of aluminum foil sticked to a piece of construction paper. This was like a blanket covering the power electronics. It was quite unusual but it went out to the market as such. We joke around saying it was for EMC and temperature tests "with this blanket the chassis won't catch a cold" :-) What's your unusual fix?

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Sanjib.Acharya

6/28/2011 10:41 PM EDT

I think covering the power electronics circuit with a shield is not very unusual. For more than one instances we had to use a metallic cap for the transformer in the DC-DC switching circuit. Some other time, we had to use specially designed metallic contacts to connect the board ground to frame ground when the board is inserted to chassis. They used to look unusual to me when I was implementing them, but doesn't look unusual now. May be, when the possible solution is thought of to resolve an EMC issue (which becomes very tough at times), that seems unusual. Then we implement it, we get excited to find it working and that solution becomes part of our experience and the unusual solution no more looks unusual.

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ENGINEER_NTM

6/30/2011 12:13 AM EDT

The reason for unusual shapes of EMI/EMC fix is to ignore possible effects of EMI/EMC and its solutions at early stage of product design. In most cases product design is considered to be functional only. But when it comes for environmental and actual field testing the issues pop up. Then with extisting design (Hardware and Mechanical, modification to which is time consuming and expensive)we try to fix giving weird shapes....So it's always better to think about EMI/EMC at the begining which gives robustness and may enhance the look of the product.....I see this change in mobile handsets. In early days mobiles handsets were bulky with metal extra shield and electronics look some project going inside....but nowdays metal case-cover itself is EMI/EMC shield and electronics look more dense with efficient placement...emerging technologies in embedded electronics definitely help in this.

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GREAT-Terry

7/4/2011 11:50 PM EDT

EMC is a large topic and I hope to see more indepth articles that show more practical examples on how to fix the problem case by case.

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Skyhigh

9/14/2011 6:50 AM EDT

Hardware designed by an experienced engineer in EMC, mixed-signal circuits and high-speed digital systems usually do not require patchwork using copper tape and foil to pass EMC. That's because the design is carefully implemented right from the beginning.

Hardware outsourced to cheap 3rd party PCB designer to do routing work will usually resort to just-in-time patchwork to marginally pass EMC.

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