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Design Article

Achieving loud, rich sound from micro speakers

Shawn Scarlett, Director of Marketing, Mobile Audio, NXP Semiconductors

7/25/2012 11:34 AM EDT

The benefits of an additional DSP

System designers would prefer to integrate any processing into the main system. Processing in the phone chipset will generally indeed give the smallest, most power efficient, and cheapest solution. However, accurate feedback is the key to successful speaker boost, and it needs low latency and high bandwidth.

Comprehensive speaker protection actually requires multiple input points - just knowing current and voltage isn't enough. Furthermore, interrupts and system integration issues can become a major hassle. Multiple sensing points are needed to optimize the amplified signal. The processing must also optimize the performance of both amplifier and DC/DC converter.

To properly integrate this system into the central processor, all these signals would need to be converted and fed in to the chipset and all the controls properly taken out. A separate DSP can handle all these interactions automatically and can run continually even when the central processing shuts down.

The TFA9887 for speaker boost and protection
NXP's TFA9887 (Figure 4) is offered as the first IC to dramatically boost output while fully protecting the speaker. It has an embedded CoolFlux DSP, Class-D amplifier with integrated current sensing, and intelligent DC/DC boost converter.

Figure 4. Block diagram of TFA9887.

The IC holds a software model of the speaker, and automatically adapts to any changes over the speaker's lifetime including ageing, enclosure damage, blocked speaker ports, or whatever the world can throw at it. Better sound quality can also be traded against even smaller speakers and back volumes, giving smaller end products.

To confirm its performance, we compared the SPL of a speaker driven by the TFA9887 with a popular unmodified smart phone which uses a software compressor to enhance the volume. The test used identical test files and an identical phone (so identical speaker and enclosure).

Figure 5 shows more than 6 dB SPL increase in output volume. Optimized for bandwidth, bass output is increased by around 10 dB SPL - a huge improvement for a simple replacement in a state-of-the-art reference phone!

Figure 5. Volume and bass levels from the TFA9887 are noticeably improved.

Figure 6. Despite delivering around 2.5 W peak into a 0.5 W speaker (and over 5 W into a 4-ohm speaker), the excursion for music and speech clearly remains well within specifications.

This leap in performance illustrates an important design trend. The days of stand-alone amplifiers and converters designed in isolation have gone. The performance of phones and other portable devices have seen so many refinements that components must be treated as part of a bigger system. Each part of the system must sense and interact with the real world for best possible system performance.

So, audio systems must monitor the performance of the acoustics and adjust for the best user experience (Figure 6). Here as elsewhere, there is a clear trend to producing systems that measure and interact with the real world.

About the author
Shawn Scarlett is the marketing director for NXP’s mobile audio group, with a long history specializing in audio semiconductors including positions at Analog Devices and National Semiconductor, as well as start-ups such as Tripath and GTRonix. He has a B.S. in Electrical Engineering from the University of Arizona as well as an MBA from Santa Clara University. Before moving into semiconductors, he developed his audio skills as a professional sound engineer with the I.A.T.S.E working on sound reinforcement for major touring shows.





Tony Casey

7/26/2012 4:08 AM EDT

It is not strictly correct to state that loudspeaker impedance rises linearly with temperature. Only the resistive part of impedance due to the voice coil behaves this way.
Over most of the frequency range of a typical moving coil loudspeaker, the impedance is dominated by either the motional impedance caused by back-emf at low frequencies, or voice coil inductance at high frequencies. It is only essentially resistive in a narrow frequency range between these two, where it is largely determined by the voice coil resistance.
Any attempt to infer temperature by measuring current, must therefore take this into account (presumably by bandpass filtering the current sense signal).

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calebcrome

7/30/2012 2:06 AM EDT

Good point. But the *rise* in impedance should be linear with temperature. so, if you take a 25C measurement across the spectrum, you should get a nice linear increase across the full spectrum as temperature increases.

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Tony Casey

7/30/2012 7:06 AM EDT

That's not something you can rely on either.
For example, suspension compliance will change significantly with temperature, changing both the resonant frequency and impedance peak. Moving mass, on the other hand, should remain constant. :-)

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bcarso

8/1/2012 6:02 AM EDT

Yes, and not only with temperature but with aging. Ideally, positional determination should be independent.

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bcarso

7/26/2012 12:20 PM EDT

OK, so as far as I can tell the cone positional information is not exactly acquired in real time (which would be very difficult) but rather developed as a model which resides in the DSP.

Brad

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AJW in OR

7/26/2012 12:58 PM EDT

Does this part have any value for piezo speakers?

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tbia

7/26/2012 3:21 PM EDT

While what the author is stating is true it is much more important to provide a means of acoustic control over the diaphragm. The low frequencies need not be limited by back EMF nor the highs by inductance if a means to provide constant pressure behind the driver is provided. Typically the driver will have a more shallow roll off and not experience as much breakup under these conditions. Pat.7207413 B2 and others pending to allow for dynamic volume modification of the enclosed volume behind the driver. Impedance variations are also not as aggressive and critically damped resonance peaks enhance bass response. These conditions are established pre-electronics allowing for less aggressive DSP requirements to fix the speaker.

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agk

7/27/2012 8:37 AM EDT

Author has briefed an important topic and triggered my thoughts. Always there is research going on improving the quality of the sound produce by the loud speakers. This is because the loud speaker efficiency is around 5% maximum. When it comes to fidelity again a quite a lot of limitations. This is because the speaker has to reproduce about more than a 1000 different types musical instruments sounds from a big drum to a smallest string instrument.So naturally it is difficult to design a single transducer to reproduce these sounds.And micro loudspeakers really tough to satisfy.Researchers can think of any other new type of transducer.

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I_B_GREEN

8/3/2012 7:13 PM EDT

How about using some of that air pumping functionality to cool the coil?
Add a sub chamber and and a mechanical diode (one way valve for the air) and project it along the coil or better inside it.
badabing badabong.
Now only do this at the exteme travel points and add damping and only pump cooling air when at max power when you need it.

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