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Optimizing power supply for test applications 5/23/2013
Prepare yourself for Geek Pride Day (May 25) 5/23/2013
Thermocouple nodules, cold junctions and integration opportunities 5/23/2013
Deep packet inspection—Use cases, requirements and architectures—Part II 5/22/2013
Measuring the transition to disaster 5/21/2013
World's first field-programmable radio frequency (FPRF) chip 5/21/2013
Address jitter and noise more effectively with DDR4, part1 5/21/2013
Triangulation in automotive ultrasonic park-assist systems 5/21/2013
Globalfoundries joins Qualcomm in MRAM research 5/21/2013
Samsung 45-nm embedded flash coming in 2014 5/20/2013
Electromagnetic Interference (EMI) Pt 2 5/20/2013
Imperas launches multicore software development tools 5/20/2013
Renesas signs with IMEC for short-range radio research 5/17/2013
ST turns to PCM for MCU embedded memory 5/17/2013
Amazon buys Samsung display subsidiary Liquavista 5/17/2013
FDSOI gains three design wins 5/16/2013
All eyes on Zynq SoC for smarter vision 5/16/2013
Artificial heart ready for human trial 5/16/2013
The Internet of Things' next wave 5/15/2013
Taiwan's microelectronics expertise widens 5/15/2013
Memory IP startup pursues FinFET, FDSOI processes 5/15/2013
Deep packet inspection--Use cases, requirements and architectures—Part I 5/15/2013
Embedded flash startup in production at three foundries 5/15/2013
Video: Simulator lets race drivers feel their designs 5/14/2013
Do annular electrodes present a scalable PCM solution? - Part 2 5/14/2013
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