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Communications Design Features

Deep packet inspection—Use cases, requirements and architectures—Part II

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Address jitter and noise more effectively with DDR4: Part 1

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Electromagnetic Interference (EMI) Pt 2

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Radisys: Seven questions (and answers) on VoLTE, LTE-Advanced, telecom cloud deployment

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Deep packet inspection--Use cases, requirements and architectures—Part I

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An overview of ZigBee's Smart Energy Profile 2.0 standard

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Teardown: HTC One smartphone

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Slideshow: Spotlight on Tutorials—Top 10 Industrial Control Tutorials for Q1

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M2M is dead: long live IoT

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Channel compensation methods used in JESD204B converters

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Technical Papers

Coherent Optical Signal Generation with High-Performance AWG

Accelerating, Analyzing, and Securing Network Traffic

System-Level and Application Specific ESD Protection Guide

Courses and Webinars

Effective Crosstalk Characterization

Achieving Energy Efficiency in the Internet of Things Era

Teardowns

FitBit blends wireless, MCUs and MEMS with online interface

BenQ K60 e-reader: Trying to stand on the shoulders of giants

CMOS power amplifiers penetrating 3G handsets

Wide Bluetooth, Wi-Fi adoption seen in handsets

Yukyung marshals army of chip vendors for Viliv tablet

Inside the Samsung Galaxy Tab: Taking on the iPad

Inside Xbox 360's Kinect controller

N8: Solid start for Nokia’s Symbian^3 strategy

CE parts met cockpit avionics in vintage F-15 video camera

Omron home blood pressure monitor taps semiconductor scaling

More Design Teardowns >

Reference Designs

Quantenna debuts 802.11n 4x4 MIMO wireless video bridge ref design

Quantenna Communications Inc. has debuted a complete reference design based on its QHS600 IEEE 802.11n wireless LAN (WLAN) 4x4 multiple input, multiple output (MIMO) chipset.
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Lattice adds over 90 reference designs for PLDs

Lattice Semiconductor Corp. has released more than 90 reference designs optimized for the MachXO and ispMACH 4000ZE PLDs.
Learn more >

More Reference Designs >

Products

Tiny PCIe clock generators ease power consumption, design complexity

Murata DC/DC converter employs PMBus-compatible digital interface

Top-actuated switches enable easy identification in complex systems

Altera Stratix V GX FPGAs achieve PCIe Gen3 compliance

Chrontel expands DisplayPort-to-LVDS conversion chip line

Multilayer stacked capacitors offer high temperature reliability

Commentary

ARM TechCon 2013 – Call for Papers Now Open

Clive Maxfield

Now in its seventh year, ARM TechCon is ranked one of the top three critical events in the embedded sector.

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Mega-cool Camera Lucida app for the iPad

Clive Maxfield

Initially I assumed that this app was for drawing on the iPad screen … I was so wrong!

Join  post comment   2 comments    last comment  Max the Magnificent
Please, PLEASE share your painting with us -- maybe showing it in different states of completion and ...

Brussels Calling: Qualcomm wins in a wasteful industry

Peter Clarke

Is there a difference between the U.S. and Europe on green and sustainability issues? It appears there is to judge from an interaction at the IMEC Technology Forum here yesterday.

Join  post comment   9 comments    last comment  docdivakar
Understood Peter! I do give credit to the European initiatives where it is due, as in WEEE and RoHS. ...

25% of notebooks to feature touchscreens by 2016

Dylan McGrath

Thanks to falling prices and a push from Intel, 2013 is expected to be the start of a booming growth spurt for touch-screen equipped notebooks.

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Your chance to win an Exploration & Discovery experience and go behind the scenes at NASA!

Clive Maxfield

Littelfuse's Speed2Design Exploration & Discovery program brings engineers behind-the-scenes at NASA's Ames Research and Johnson Space Centers.

Join  post comment   2 comments    last comment  Monkey_noise
I got all excited, filled in the registration form, then saw the rules...US only. :-( I'm UK

Collaborative Advantage: OpenDFM achieves production status

Steve Schulz

The OpenDFM standard has achieved production support status for process nodes down to 28nm, and development support through 20nm…

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Recent Comments

Jack.L  05.25.2013
Research gap threatens innovation, experts warn
Perhaps this is really an issue of a narrow industry perspective. While basic research is not ...
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GroovyGeek  05.24.2013
Intel pushes for more research beyond 10-nm
You know a lot less than you think you do. I do agree that most talks from Intel are scant on ...
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GroovyGeek  05.24.2013
Broadcom: Time to prepare for the end of Moore’s Law
Plenty of pundits have predicted the end of CMOS scaling before, but rarely veteran executives of ...
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Most Commented

Intel's new CEO shakes things up

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Broadcom: Time to prepare for the end of Moore’s Law

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Are the best engineers OCD?

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Europe launches $12 billion chip support campaign

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LED lighting control using powerline communication

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Reader Message Boards

News, Analysis, and Opinion

Facebook kills smartphone's European debut

Broadcom: Time to prepare for the end of Moore’s Law

Broadcom’s CTO on Ethernet’s six key directions

Mellanox to acquire silicon photonics developer Kotura

Europe launches $12 billion chip support campaign

AMD launches 3 mobile APUs

 

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EETimes 40th Anniversary iPad App celebrates the visionaries, technologies, and events which have defined the electronics industry.

Meet the Editor
The Communications DesignLine is edited by Carolyn Mathas. Please contact cmathas@earthlink.net if you are interested in submitting a technical article or a guest blog.


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