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Marvell rolls quad-core LTE combo chip 5/21/2013
Address jitter and noise more effectively with DDR4: Part 1 5/21/2013
Triangulation in automotive ultrasonic park-assist systems 5/21/2013
Globalfoundries joins Qualcomm in MRAM research 5/21/2013
Samsung 45-nm embedded flash coming in 2014 5/20/2013
Electromagnetic Interference (EMI) Pt 2 5/20/2013
Imperas launches multicore software development tools 5/20/2013
Renesas signs with IMEC for short-range radio research 5/17/2013
ST turns to PCM for MCU embedded memory 5/17/2013
FDSOI gains three design wins 5/16/2013
Radisys: Seven questions (and answers) on VoLTE, LTE-Advanced, telecom cloud deployment 5/16/2013
All eyes on Zynq SoC for smarter vision 5/16/2013
Artificial heart ready for human trial 5/16/2013
The Internet of Things' next wave 5/15/2013
Deep packet inspection--Use cases, requirements and architectures—Part I 5/15/2013
Embedded flash startup in production at three foundries 5/15/2013
Do annular electrodes present a scalable PCM solution? - Part 2 5/14/2013
Altera to buy Enpirion for on-chip power conversion 5/14/2013
An overview of ZigBee's Smart Energy Profile 2.0 standard 5/14/2013
Micromirror development tool takes aim at 3-D printing 5/14/2013
MCU functionalities change for ISO 26262 safety standard 5/14/2013
Bell Labs group aims at 90% energy-saving in networks 5/13/2013
Energy Micro adds Cortex-M4 based MCUs 5/13/2013
Infineon, Renesas see sales tumble in industrial ranking 5/10/2013
Channel compensation methods used in JESD204B converters 5/9/2013

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