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EDA Design Features

Reflections and transmission lines

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Creating highly reliable FPGA designs

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Adding an LCD to your microcontroller application made easy, inexpensive, & fun!

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Using non-volatile memory IP in system on chip designs

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Microchip to acquire embedded memory IP supplier

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Raspberry Pi online Maker Training Camp now open

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ARM aims at mid-range with three processors

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Performance analysis of VPX backplane in integrated modular avionics system

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Xilinx to test FinFET FPGAs in 2013

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Efficient physical-aware timing ECO solution

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Improving power consumption in NFC and HF RFID card detection systems

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Prepare yourself for Geek Pride Day (May 25)

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Electromagnetic Interference (EMI) Pt 2

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Imperas launches multicore software development tools

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FDSOI gains three design wins

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Technical Papers

Addressing the Complexity of "Smart" Devices Through Low Power Hierarchical Design

Clock and Reset Ubiquity: A CDC Verification Perspective

Break Through Your ASIC Prototyping Bottlenecks

Ten Things You Should Know about Verification IP

A smart integrated switch cell for well bias low power architecture

Courses and Webinars

Power Architecture Solutions for Industrial Control

Reliability and Qualification of MTP NVM IP from Commercial to Automotive Applications

Fundamentals of Measurement

Fundamentals of USB

Fundamentals of Analog Verification

Teardowns

CMOS power amplifiers penetrating 3G handsets

Intel's 22-nm process gives MOSFET switch a facelift

More Design Teardowns >

Reference Designs

Quantenna debuts 802.11n 4x4 MIMO wireless video bridge ref design

Quantenna Communications Inc. has debuted a complete reference design based on its QHS600 IEEE 802.11n wireless LAN (WLAN) 4x4 multiple input, multiple output (MIMO) chipset.
Learn more >

Lattice adds over 90 reference designs for PLDs

Lattice Semiconductor Corp. has released more than 90 reference designs optimized for the MachXO and ispMACH 4000ZE PLDs.
Learn more >

More Reference Designs >

Products

Camera showdown at CameraRocket.com

Formality tackles ECOs

Microsemi introduces highly-integrated IGLOO2 FPGAs

Microchip's new PIC32MX 32-bit microcontroller portfolio

Atmel announces new SAM D20 series of ARM Cortex-M0+ MCUs

EDA tool optimizes cell libraries for processor cores in SoCs

Synopsys releases one library to rule them all

Microchip's real-time power monitoring and code optimization

Kickstart IoT development with TI’s new SimpleLink Wi-Fi CC3000 BoosterPack

American Semiconductor's FleX-MCU – The first physically flexible microcontroller.

Commentary

DAC Keynote from James Truchard

Brian Bailey

James Truchard says the future is all about platform based design and that if you are an RTL designer, you had better start becoming a software engineer…

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Let me ramble a comment here. First, what the spreadsheet did for financial analysis is that it ...

EDA/IP weekly roundup – June 19th 2013

Brian Bailey

Arasan, Cadence, IBM, IEEE, Intellitech, Mentor, Real Intent, Toshiba, UMC and X-FAB made the lineup today. See here for their news…

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Saddleback Leather meets airport security

Clive Maxfield

An interesting thing happened to me on my recent trip to New York…

Join  post comment   8 comments    last comment  Max the Magnificent
GROAN!!!!!!

Atrenta’s Ajoy Bose: lessons from an entrepreneur

Brian Bailey

What would Ajoy Bose say to an aspiring entrepreneur?

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Duck! Low-flying pizza!

Clive Maxfield

Can you imagine a future in which the skies (and restaurants) are jam-packed with miniature copters?

Join  post comment   12 comments    last comment  Max the Magnificent
It wouldn't matter -- they wouldn't be able to catch me :-)

What were they thinking: A place to sleep

Brian Bailey

An interesting little patent today that shows how simple a patent can be...

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The future is here (but I'm not ready)

Clive Maxfield

In my previous blog we pondered the past. In today's column I'd like to contemplate, ruminate, and speculate about the future…

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Obligatory link relating to mini bars (WARNING: may contain bad ...

Recent Comments

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GoGoGeek  06.19.2013
What do IBM layoffs mean for New York's chip initiative?
What will happen with the 300mm Fishkill facility?
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Most Commented

Intel processor outperforms Nvidia, Qualcomm, Samsung

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Packaging takes front and center stage

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Reader Message Boards

News, Analysis, and Opinion

Global FDSOI ecosystem rising

Broadcom: Time to prepare for the end of Moore’s Law

Microchip’s MASTERs Conference for embedded-control engineers

Altera acquires TPACK; expands OTN solution capabilities

3-D interposers stack chips

TSMC starts FinFETs in 2013, tries EUV at 10 nm

China Fabless: Allwinner's secret to tablet IC success

Silicon Valley Nation: Memoir's CEO shift, new direction

China, India outspending U.S. in semiconductors

Tensilica acquisition to accelerate Cadence core strategy

 

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Meet the Editor
Hi, I'm Brian Bailey and I'm the editor of the EDA DesignLine. If you are interested in submitting a technical article, blog or product announcement, or just want to reach out say hello, you can call me at 503-352-4336 or email me at brian_bailey@acm.org.

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