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Design Article

Evolution of manufacturing closure for advanced nodes (Part 2)

Ivailo Nedelchev, Sudhakar Jilla, Mentor Graphics Corp.

2/28/2011 4:51 AM EST

Starting at the 40/45nm design node, DRC/DFM closure emerged as a significant new challenge to IC designers. No longer could manufacturing concerns be effectively handled with the traditional design-then-verify flow. This trend is expected to continue and worsen at the 32nm and 22nm nodes, where manufacturing closure may become a serious bottleneck in design schedules. The reasons behind the growing difficulty of manufacturing closure are explored in part 1 of this series.

The traditional flow, which consists of completing the physical design before performing physical verification checks and DFM improvements, is based on a key assumption—that the place and route tool can get close enough to make physical signoff predictable. In the past, this was a reasonable assumption and the methodology worked. But at sub-40nm it begins to break down as the previous generation routers are not designed to handle the many new and complex DRC/DFM rules.

To access the full Design Article by Mentor Graphics Corp. (in PDF format), click here.

Read also: Evolution of manufacturing closure for advanced nodes (Part 1)

About the authors:
. Ivailo Nedelchev, principal technologist, Place and Route Division, Mentor Graphics Corp.
. Sudhakar Jilla, marketing director, Mentor Graphics Corp.

Courtesy of EE Times India




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