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docdivakar

1/29/2013 3:53 PM EST

The article clearly needs to emphasize the metric current density vs. current ...

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Addressing signal electromigration (EM) in today’s complex digital designs

Geetha Rangarajan – Synopsys, James Deng – Altera

1/28/2013 10:53 AM EST

Addressing signal EM during place & route
The three main components of an optimal EM solution are – analysis, prevention and fixing.

•    Analysis
Accurate signal EM analysis relies on a wide spectrum of data that includes modeling, extraction, timing, switching activity and foundry EM constraints/limits. There are two main steps in EM analysis – effective current calculation and EM violation detection (Fig 5).
Effective current, which includes computing peak, RMS (Root Mean Square) and average values, helps evaluate the cumulative EM effect on a conductor. The analysis engine needs to determine these current values for every routing segment and via in the design. With designs today operating under different modes and corners, these current values (effective current and EM limit) will vary based on the timing, voltage and temperature in every scenario. It is therefore critical to have an EM analysis engine that is multi-corner, multi-mode (MCMM) aware.
 
Figure 5: [Components of Signal EM Analysis], Source: Synopsys

Once effective current values are determined, an EM violation is detected based on the current limits derived from the foundry EM constraints (Fig 6).


Figure 6: [EM Violation Detection], Source: Synopsys

Prevention
Prevention can be implemented for signals that have an increased probability for EM violation. For instance, due to their high toggle rates and large drive cells, clock nets are more at risk for EM than data nets.  Clock nets with special width and spacing rules (NDRs) derived from their driver cells can help minimize the impact of EM. When applied during clock tree synthesis and honored during route, these NDRs enable a correct by construction approach to minimize unnecessary perturbation on the clock nets during signal routing
•    Fixing
EM fixing is a function of sizing wires, vias and cells in order to effectively reduce the current density through them. A comprehensive fixing solution much like analysis would also need to be MCMM-aware. Two commonly used EM fixing approaches are wire widening and cell sizing.
Wire widening
Widening wires help increase allowable current limits and is an effective way to reduce EM effect. This can be achieved by either applying NDRs on nets or just by sizing up the violating segments. The latter would be more suitable to designs that are prone to congestion.

Cell sizing
Using smaller driver cells can help slow down data transition, which in turn reduces current density and the impact of EM. This method is effective when there is sufficient timing margin.

In addition to providing a robust MCMM-aware analysis and fixing mechanism, an ideal solution should have certain key features to facilitate adoption. Providing seamless integration into a P&R flow would offer easy setup and quick turnaround time. Not all EM violations are automatically fixable, hence user control on techniques along with an intuitive GUI is needed for faster analysis and debug.  Lastly, an EM solution within place and route is effective only when it is accurate and convergent, making correlation to industry-standard SPICE simulators a must.
IC Compiler EM solution - Ideal for today’s complex designs
IC Compiler place and route offers an integrated signal EM solution. It provides comprehensive MCMM-aware analysis and an automated EM fixing flow.  Use of a consistent database provides fast turnaround times, and a powerful GUI aids analysis and debug of EM violations.





docdivakar

1/29/2013 3:53 PM EST

The article clearly needs to emphasize the metric current density vs. current magnitude whether effective, RMS or average values! Temperature effects are of course important but current densities all the way to chip-to-chip (in case of 3D / 2.5D IC) and chip-to-package-level interconnects. Metal lines in IC can take 1E6 Amp/cm^2 current density but interconnects (flipchip or wirebond) and TSV's have lower limits.

MP Divakar

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