Design Article
KLA-Tencor hones litho/etch process control
3/5/2013 2:18 PM EST
Two new tools from KLA-Tencor—the SpectraShape 9000 optical critical-dimension metrology system and the BDR300 backside-defect inspection and review module—enable volume production of integrated circuits at sub-20-nm design rules.
The products help manufacturers deal with tight process tolerances in lithography and etch by focusing on two key issues: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures caused by small deviations in shape.
Click to read the rest of this story on EDN.
The products help manufacturers deal with tight process tolerances in lithography and etch by focusing on two key issues: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures caused by small deviations in shape.
Click to read the rest of this story on EDN.
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