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More RF & Microwave Designline Features

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Infineon launches 3-D sensor for gesture recognition 5/29/2013
Improving the Doherty amplifier 5/29/2013
Improving high-end active speaker performance using digital active crossover filters 5/29/2013
Intel is buyer of ST-Ericsson GPS unit 5/29/2013
Samsung sells MCU business 5/29/2013
Choosing RF protocols for industrial, scientific and medical applications 5/28/2013
Multicore delivers multi-gigabits over microwave links 5/28/2013
Address jitter and noise more effectively with DDR4: Part 2 5/28/2013
Mystery buyer found for ST-Ericsson's connectivity business 5/28/2013
Efficient physical-aware timing ECO solution 5/27/2013
Improving power consumption in NFC and HF RFID card detection systems 5/24/2013
Volkswagen to lead MCU energy benchmark group 5/24/2013
Optimizing power supplies for test applications 5/23/2013
Prepare yourself for Geek Pride Day (May 25) 5/23/2013
Thermocouple nodules, cold junctions and integration opportunities 5/23/2013
Measuring the transition to disaster 5/21/2013
World's first field-programmable radio frequency (FPRF) chip 5/21/2013
Triangulation in automotive ultrasonic park-assist systems 5/21/2013
Samsung 45-nm embedded flash coming in 2014 5/20/2013
Electromagnetic Interference (EMI) Pt 2 5/20/2013
Imperas launches multicore software development tools 5/20/2013
Renesas signs with IMEC for short-range radio research 5/17/2013
ST turns to PCM for MCU embedded memory 5/17/2013
FDSOI gains three design wins 5/16/2013
Radisys: Seven questions (and answers) on VoLTE, LTE-Advanced, telecom cloud deployment 5/16/2013

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