datasheets.com EBN.com EDN.com EETimes.com Embedded.com PlanetAnalog.com TechOnline.com  
Events
UBM Tech
UBM Tech

Design Article

Comment


DoctorZ

5/14/2012 2:25 PM EDT

Advanced thermal management materials, which have low coefficients of thermal ...

More...



Bhola_#1

10/30/2010 1:12 AM EDT

Interesting but there are others that run below -55 C and quite challenging ...

More...

Avionic & military applications need -55°C operation

Steve Knoth, senior product marketing engineer, Linear Technology Corporation

10/20/2010 6:06 AM EDT

Different protection for different conditions
A problem in battery-powered systems is the threat of damage to the IC and/or the load when an end-user inserts the battery with reverse polarity or misconnects the battery, i.e. in a vehicular system. If an IC is exposed to a reverse voltage, large currents will flow to ground through parasitic junctions in the IC, potentially destroying fragile junctions. Insertions of single or multiple diodes help, but these fixes waste power and reduce the supply voltage by adding diode drops between the battery voltage and the supply rail. An alternative on-chip solution would not only protect the IC and the load but eliminate those tradeoffs resulting from adding more components.

Reverse output voltage protection prevents reverse current from flowing through the IC’s parasitic body diodes under a reverse output voltage condition, or if the load is returned to the negative supply rail, or if the negative supply is turned on before VIN, or if the output is sitting at the negative rail’s potential during power up.

Linear regulators can be easily destroyed if they are forced to source excessive current. Therefore, current limiting (short circuit) protection circuitry kicks under short circuit or excessive load conditions in which VOUT<VIN; the current limiting circuitry prevents excessive current flow from VIN to VOUT. In a short circuit condition, not only is the pass transistor sourcing excessive current, the voltage across it is at a maximum (since VOUT is at ground, the voltage across the transistor is VIN.). Linear regulators typically use one of two types of short circuit protection on-chip: constant current limit or a more sophisticated form, current limit with foldback. The addition of foldback protection to the current limit decreases the current limit as the input voltage increases to keep the power transistor in its safe operating area (SOA).

When VOUT>VIN, i.e. if VIN is shorted or VOUT is pulled above VIN, the reverse current (a.k.a. reverse output-to-input) circuitry prevents any flow of reverse current from VOUT to VIN.

With thermal shutdown protection, an IC is actually shut off and the die must cool down by the amount of hysteresis built into the thermal shutdown circuitry. Once the part has cooled down sufficiently, it is restarted. If a fault or overload condition exists, the part heats back up to the thermal shutdown temperature and turns itself back off. Therefore, the part sits and thermally oscillates at some low frequency and duty cycle depending on the thermal shutdown temperature, the amount of hysteresis, the package and the associated thermal time constants.

Thermal limiting is a slightly less sophisticated technique than thermal shutdown, in which the maximum die temperature is controlled by the protection circuit.

The ideal solution to the problems and required protection features outlined above would be a family of low dropout linear regulators that can operate with high precision and offer bulletproof protection features across the entire junction temperature range of -55°C to +125°C.

Problems solved
Linear Technology has provided bulletproof, reliable, high performance PNP and NPN LDO regulators operating across the extended industrial junction temperature range of -40°C to +125°C for many years. However, sophisticated wafer fabrication technology enhancements and improved layout techniques have allowed extension of the operating junction temperature range down to -55°C, opening up a variety of “high reliability” military range applications, unleashing a new generation of military plastic or “MP-grade” devices.

Linear’s new MP-grade portfolio encompasses output currents from 20mA (LT3008) all the way up to 5A (LT3070), with dropout voltages as low as 85mV, input voltages as high as 80V, ultralow output voltage noise as low as 20uVrms, sub-5uA quiescent currents and a full set of protection features. See Table 1 for a portfolio summary.


Table 1: Linear Technology’s family of MP-grade single output LDOs
(Click on image to enlarge)




JMWilliams

10/21/2010 6:14 PM EDT

This was an interesting article.

It would have been more interesting yet, if the author had discussed some more detail on causes and effects of operation of IC's below their rated temperature range.

For example, increased conductance of metals and decreased semiconductor carrier mobility might be factors. What about brittleness of chips and packages because of the cold? I don't know . . ..

Sign in to Reply



JMWilliams

10/21/2010 6:14 PM EDT

This was an interesting article.

It would have been more interesting yet, if the author had discussed some more detail on causes and effects of operation of IC's below their rated temperature range.

For example, increased conductance of metals and decreased semiconductor carrier mobility might be factors. What about brittleness of chips and packages because of the cold? I don't know . . ..

Sign in to Reply



BalaLak

10/24/2010 12:54 AM EDT

I agree with the other comment by JMWilliams. The first half of the article is definitely interesting. I'd have liked to see more specific details about effects of low temp (less than -40 degC) operation - in terms of design vs characterization trade-offs, process & material qual challenges.

Sign in to Reply



mike_lavoie

10/27/2010 10:16 AM EDT

Good Article but a little misleading. the title "Avionic & military applications need -55°C operation" lead me to believe that he would cover all IC's or at least a larger percentage than just LDO's. We deal with -55 & even -60 requirements and it is very challenging so how about some tips on how to make commercial grade work at these temperatures. Screening of components, heaters, holding the circuits in reset until temp rises, better heat sinks and fans for hi temp are a few of the techniques we use. I agree with JW, what are the mechanisms that effect components at these temperatures?

Sign in to Reply



Bhola_#1

10/30/2010 1:12 AM EDT

Interesting but there are others that run below -55 C and quite challenging performance wise, especially large signal due to different technologies (such as phempt LNA etc.)

Sign in to Reply



DoctorZ

5/14/2012 2:25 PM EDT

Advanced thermal management materials, which have low coefficients of thermal expansion, can minimize thermal stresses and warping at low temperatures. In addition, they have low densities and thermal conductivities up to 1700 W/m-K. They are well established in aerospace/defense and commercial applications. If anyone wants papers on the subject, send me an email at c.h.zweben@usa.net

Sign in to Reply



Please sign in to post comment

Navigate to related information

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)