Design Article
Comment
DoctorZ
Advanced thermal management materials, which have low coefficients of thermal ...
Bhola_#1
Interesting but there are others that run below -55 C and quite challenging ...
Avionic & military applications need -55°C operation
Steve Knoth, senior product marketing engineer, Linear Technology Corporation
10/20/2010 6:06 AM EDT
Conclusion
The COTS initiative from the mid 1990’s has had a wide-ranging effect on both the military and the semiconductor IC industry. One result was an increase in industrial-grade ICs being integrated into military, avionic and commercial aircraft systems. However, the -40 to +85°C temperature range, or even the extended industrial -40°C to +125°C range is not sufficient for applications.
Linear Technology has developed a new family of high reliability, MP grade products including LDOs and µModule regulators, that extend operation down to -55°C. These MP LDOs offer the same wide voltage range, high accuracy, low dropout, high reliability and bulletproof protection that Linear’s LDOs are known for.
About the author:
Steve Knoth is senior product marketing engineer at Linear Technology Corporation.
The COTS initiative from the mid 1990’s has had a wide-ranging effect on both the military and the semiconductor IC industry. One result was an increase in industrial-grade ICs being integrated into military, avionic and commercial aircraft systems. However, the -40 to +85°C temperature range, or even the extended industrial -40°C to +125°C range is not sufficient for applications.
Linear Technology has developed a new family of high reliability, MP grade products including LDOs and µModule regulators, that extend operation down to -55°C. These MP LDOs offer the same wide voltage range, high accuracy, low dropout, high reliability and bulletproof protection that Linear’s LDOs are known for.
About the author:
Steve Knoth is senior product marketing engineer at Linear Technology Corporation.
|
|
|
|
|
Navigate to related information
JMWilliams
10/21/2010 6:14 PM EDT
This was an interesting article.
It would have been more interesting yet, if the author had discussed some more detail on causes and effects of operation of IC's below their rated temperature range.
For example, increased conductance of metals and decreased semiconductor carrier mobility might be factors. What about brittleness of chips and packages because of the cold? I don't know . . ..
Sign in to Reply
JMWilliams
10/21/2010 6:14 PM EDT
This was an interesting article.
It would have been more interesting yet, if the author had discussed some more detail on causes and effects of operation of IC's below their rated temperature range.
For example, increased conductance of metals and decreased semiconductor carrier mobility might be factors. What about brittleness of chips and packages because of the cold? I don't know . . ..
Sign in to Reply
BalaLak
10/24/2010 12:54 AM EDT
I agree with the other comment by JMWilliams. The first half of the article is definitely interesting. I'd have liked to see more specific details about effects of low temp (less than -40 degC) operation - in terms of design vs characterization trade-offs, process & material qual challenges.
Sign in to Reply
mike_lavoie
10/27/2010 10:16 AM EDT
Good Article but a little misleading. the title "Avionic & military applications need -55°C operation" lead me to believe that he would cover all IC's or at least a larger percentage than just LDO's. We deal with -55 & even -60 requirements and it is very challenging so how about some tips on how to make commercial grade work at these temperatures. Screening of components, heaters, holding the circuits in reset until temp rises, better heat sinks and fans for hi temp are a few of the techniques we use. I agree with JW, what are the mechanisms that effect components at these temperatures?
Sign in to Reply
Bhola_#1
10/30/2010 1:12 AM EDT
Interesting but there are others that run below -55 C and quite challenging performance wise, especially large signal due to different technologies (such as phempt LNA etc.)
Sign in to Reply
DoctorZ
5/14/2012 2:25 PM EDT
Advanced thermal management materials, which have low coefficients of thermal expansion, can minimize thermal stresses and warping at low temperatures. In addition, they have low densities and thermal conductivities up to 1700 W/m-K. They are well established in aerospace/defense and commercial applications. If anyone wants papers on the subject, send me an email at c.h.zweben@usa.net
Sign in to Reply