Tests of tin-lead BGA packaging for mil-aero applications

Introduction

Each year the military and aerospace sector demands higher-speed systems with better accuracy at lower cost. Increasingly stringent size, weight and power constraints, together with the demanding power supply requirements of large FPGAs, have led to a decisive move towards POL (point of load) power supply architectures.

One solution to address these needs is Linear Technology’s µModule technology, providing a system-in-package solution that is claimed to simplify design and minimize external components.


The original packaging technology selected for µModule switching regulators was LGA (land grid array) and this has served the broad marketplace well. However, some applications subject to very harsh environments prefer BGA (ball grid array) interconnect, and Linear Technology has developed packaging to meet these requirements.