Design Article
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mdavismarsh
hm
I always liked NSC application notes as continuing education tools and this ...
PCB layout techniques to maximize power module performance
Don Rhodes and Marc Davis-Marsh, National Semiconductor Corp.
8/22/2010 9:55 PM EDT
This article describes the best PCB layout methods, practices and techniques to maximize the SIMPLE SWITCHER power module’s performance. It also discuses relevant thermal issues, and its lessons apply to other power-supply designs, as well.
The article is presented as a pdf file (no registration required); to read it, click here.
About the Authors
Don Rhodes is a field applications engineer with National Semiconductor Corp., and is based in Tigard, Oregon. He received his BSE degree from Chapman University.
Marc Davis-Marsh is an applications engineer with National Semiconductor Corp., Santa Clara, Calif. He holds an MSEE and BSEE from Wright State University, Dayton, Ohio.
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Borge
8/23/2010 5:40 AM EDT
Thanks for an interesting article! My own experience from years of PCB layout is that the hardest tracks to lay out are those you don't see. Very frequently, the return current will pass in a large ground plane which is only added after all placement and routing are done. It is very important to save space which the ground plane will occupy and think about the return current paths in areas where no components or tracks are yet placed.
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hm
8/23/2010 10:25 AM EDT
I always liked NSC application notes as continuing education tools and this article also adds to it. Design / simulation tools on NSC web site also gives engineer kick start for new design. However, I may like to see following:
More advance simulation tools with detailed parts modeling for both active and passive parts. Simulation result should also generate comprehensive report with basic logic, formulas for the calculation and optimization techniques.
Second important part is measurement and verification of this simulated result with actual fabricated CCA. Many a time real time measured results are significantly different from simulated results and may not be acceptable. Can the parts manufacturer or Test and Measurement equipment manufacturers provide more educating tutorial on these aspects? e.g. basic for EMI/EMC limits, their measurement techniques and required tools, simplified ways for thermal measurement? We also need information about long term reliability for all consumer, industrial and military applications, likely failure modes in harsh operating environment.
With this information engineer may be able to make better design instead of cook book type approach.
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