Design Article
System-on-chip technology comes of age
Pushkar Ranade, senior director, of process integration, SuVolta Inc.
10/5/2012 1:25 PM EDT
Collision course
Early indications are that the SoC is very clearly on a collision course with the CPU. The Surface tablet from Microsoft highlights the choice that OEMs now have when choosing processor architecture. This tablet will be made in two versions – one using an ARM-based SoC processor (Nvidia Tegra 3) and another using an Intel x86-based CPU processor (Ivy Bridge). Table 1 compares the relevant specs of these two versions while Figure 1 shows a die-photo and block diagram of the two chips. It is evident that the SoC based design is better suited for the ultra-mobile consumer form factor where light weight and long battery life are valued more than having the highest raw performance.

Click on image to enlarge.
Table 1 Comparison of SoC (NVIDIA) and CPU (Intel) based MS Surface tablets. It is clear that the tablet with SoC is more amenable for mobile use while the one with CPU would be less amenable as a mobile device. (Source: Microsoft Surface website)
The CPU based design relies on extra chips to achieve the necessary hardware integration and consumes more power, resulting in a 30% heavier and 40% thicker product form factor. It is also interesting to note that the NVIDIA SoC design is made using lagging 40nm lithography while the Intel CPU design is made using the two generation more advanced 22nm lithography. The comparison will only get more interesting next year when the SoC players move to 28nm technology with hi-k/metal gate transistors. The Surface tablet will serve as an important benchmark since it will provide a direct comparison between the incumbent/leading-edge CPU and the disruptive/trailing-edge SoC – not only in terms of functionality but also in terms of cost.
The unique cost structure enabled by the SoC has the potential to truly disrupt the business model in the semiconductor industry. The ASP for the NVIDIA Tegra SoC chip is in the range of $20 while the ASP for a leading edge Intel IvyBridge CPU chip is in the $150 range. The CPU chip will also need to be supported by other chips to provide the functionality that is provided by a single SoC. When OEMs compete on price, it will be very difficult for the CPU product to compete while retaining historically high profit margins. As the SoC gets better and encroaches into the ultrabook and laptop space, the cost differential will have an even larger impact. The rising influence of a low-cost, low-end technology (SoC) and its potential to eat into the profit margins of a high-cost, high-end technology (CPU) is an example of the classic segment-zero phenomenon articulated by Andy Grove (1).
The NVIDIA Tegra 3 SoC and the Intel Ivy Bridge CPU are both best-in-class products – but they are designed for different form factors and cost and value metrics. While it is conceivable that the low-margin SoC may be able to serve the high-end laptop market well, it seems unlikely that the high-margin CPU will be able to serve the low-end mobile market as well.

Click on image to enlarge. Figure
1 A typical CPU design (Intel Ivy Bridge) dominated by core/graphics
compared to a highly integrated SoC (NVIDIA Tegra). The integrated SoC
design has obvious advantages in the tablet and ultrabook formfactors
(Source: Intel/NVIDIA websites).
Intel has a significant lead in CPU process technology and is at the forefront of Moore’s Law. However, radical changes to architecture (e.g. Tri-Gate) may actually slow down the integration of on-chip functionality. In spite of acquiring baseband technology from Infineon in 2011, it is unclear when Intel will be able to integrate it with Tri-Gate transistors on Atom cores. Intel’s SoC product offering has traditionally lagged its mainstream CPU offering by 1-2 years. That gap is expected to narrow in the coming years as Intel addresses the growing need for on-chip integration and the growing threat from seemingly low-end product offerings which are rapidly becoming more competitive and cost-effective in the high-end.
Next: Convergence
Early indications are that the SoC is very clearly on a collision course with the CPU. The Surface tablet from Microsoft highlights the choice that OEMs now have when choosing processor architecture. This tablet will be made in two versions – one using an ARM-based SoC processor (Nvidia Tegra 3) and another using an Intel x86-based CPU processor (Ivy Bridge). Table 1 compares the relevant specs of these two versions while Figure 1 shows a die-photo and block diagram of the two chips. It is evident that the SoC based design is better suited for the ultra-mobile consumer form factor where light weight and long battery life are valued more than having the highest raw performance.

Click on image to enlarge.
Table 1 Comparison of SoC (NVIDIA) and CPU (Intel) based MS Surface tablets. It is clear that the tablet with SoC is more amenable for mobile use while the one with CPU would be less amenable as a mobile device. (Source: Microsoft Surface website)
The CPU based design relies on extra chips to achieve the necessary hardware integration and consumes more power, resulting in a 30% heavier and 40% thicker product form factor. It is also interesting to note that the NVIDIA SoC design is made using lagging 40nm lithography while the Intel CPU design is made using the two generation more advanced 22nm lithography. The comparison will only get more interesting next year when the SoC players move to 28nm technology with hi-k/metal gate transistors. The Surface tablet will serve as an important benchmark since it will provide a direct comparison between the incumbent/leading-edge CPU and the disruptive/trailing-edge SoC – not only in terms of functionality but also in terms of cost.
The unique cost structure enabled by the SoC has the potential to truly disrupt the business model in the semiconductor industry. The ASP for the NVIDIA Tegra SoC chip is in the range of $20 while the ASP for a leading edge Intel IvyBridge CPU chip is in the $150 range. The CPU chip will also need to be supported by other chips to provide the functionality that is provided by a single SoC. When OEMs compete on price, it will be very difficult for the CPU product to compete while retaining historically high profit margins. As the SoC gets better and encroaches into the ultrabook and laptop space, the cost differential will have an even larger impact. The rising influence of a low-cost, low-end technology (SoC) and its potential to eat into the profit margins of a high-cost, high-end technology (CPU) is an example of the classic segment-zero phenomenon articulated by Andy Grove (1).
The NVIDIA Tegra 3 SoC and the Intel Ivy Bridge CPU are both best-in-class products – but they are designed for different form factors and cost and value metrics. While it is conceivable that the low-margin SoC may be able to serve the high-end laptop market well, it seems unlikely that the high-margin CPU will be able to serve the low-end mobile market as well.

As
a strong and cash rich incumbent in the sustaining CPU market, Intel’s
response to this growing segment-zero threat should not be
underestimated. Intel is expected to address this threat head-on and has
taken steps to make up for lost time in winning mobile market share.
Earlier this year, Intel released Medfield, its first SoC processor
aimed at the smartphone market. Intel also released its first reference
phone design, enabling OEMs to quickly integrate smartphone products
based on Intel technology.
The 32nm Medfield processor is expected to be replaced over the next year by an advanced 22nm processor (Merrifield) which is expected to sport a dual core Atom CPU for lower power. Even Intel’s flagship CPU products are seeing more on-chip integration. The GPU block grew significantly (an additional 400 million transistors) when Intel transitioned from the 32nm Sandy Bridge chip to the more advanced 22nm Ivy Bridge chip shown in Fig 1.
The 32nm Medfield processor is expected to be replaced over the next year by an advanced 22nm processor (Merrifield) which is expected to sport a dual core Atom CPU for lower power. Even Intel’s flagship CPU products are seeing more on-chip integration. The GPU block grew significantly (an additional 400 million transistors) when Intel transitioned from the 32nm Sandy Bridge chip to the more advanced 22nm Ivy Bridge chip shown in Fig 1.
Intel has a significant lead in CPU process technology and is at the forefront of Moore’s Law. However, radical changes to architecture (e.g. Tri-Gate) may actually slow down the integration of on-chip functionality. In spite of acquiring baseband technology from Infineon in 2011, it is unclear when Intel will be able to integrate it with Tri-Gate transistors on Atom cores. Intel’s SoC product offering has traditionally lagged its mainstream CPU offering by 1-2 years. That gap is expected to narrow in the coming years as Intel addresses the growing need for on-chip integration and the growing threat from seemingly low-end product offerings which are rapidly becoming more competitive and cost-effective in the high-end.
Next: Convergence
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sranje
10/6/2012 12:02 PM EDT
A comment on ..."As a result, Qualcomm evolved its product line-up from standalone connectivity chips by adding an applications processor (Krait ....."
If the author implies tha wireless connectiviti functions, and especially Wi0Fi, is integrated into Snapdragon application processors - he is mistaken (just like so many other analysts). The root cause are Qualcomm's functional diagrams and statements inficating Wi-Fi integration into application processor (Snapdragon is BB+AP integrated).
Qualcomm's (and Marvell's, etc.) application processors only "support" their wireless Combos.Wi-Fi and phone BB are conflicting and their integration has not been achieved yet.
Only Intel has been, as of yet experimentally, able to implement Wi-Fi in digital domai (hence fully scalable) -- in its pursuit of "wireless" Atom - an Atom with Wi-Fi built-in - probably to ne launched in 14nm in 2014/15
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swu3
10/7/2012 2:35 PM EDT
To Sranje,
I am also not clear on this but it seems like ALL the new 28nm Snapdragon S4 parts also integrate 802.11a/b/g/n onto the SOC
and these are shipping now from TSMC
MSN8230/8630/8930/8260A/8660A/8960
APQ8060A/8064
while Intel's strategy is confusing.
They published a research paper? I don't see anything shipping.
http://en.wikipedia.org/wiki/Snapdragon_%28system_on_chip%29
any insight would be appreciated
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sranje
10/8/2012 12:04 AM EDT
Dear swu3 -- I tried to explain - most analysts made the same mistake !!
Wi-Fi is NOT integrated in Snapdragon - there is a separate wireless connectivity combo IC - ALWAYS.
Snapdragon only "supports" connectivity - whatever that may mean (frequently it means an attempt to counter and stop at an OEM Broadcom's absolute connectivity dominance)
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song-chou-1
10/6/2012 1:43 PM EDT
Sranje,
I read it as to be relevant in SOC mobile market (outside of Apple and Samsung which we can not sell to since they mostly make their own), baseband and application processor integration on the same die is required. Reason Texas Instruments recently exited mobile SOC market. Also applies to Intel. Even if it has the best CPU with atom, Intel will not be relevant in mobile SOC market until baseband and CPU are integrate.
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sranje
10/6/2012 3:39 PM EDT
In Low-end smartphones BB+AP integration is a must - nobody contends that.
A completely separate subject is Wi-Fi connectivity integration into processors. So far nobody achieved it - for several reasons.
And a third subject is Intel's correct conclusion that wireless connectivity is the future in computing - hence astonishing but still engineering success of designing Wi-Fi radio entirely in digital domain (no longer analog - hence fully scalable).
Its Atom will have it - whether Atom will also integrate phone modem (that is a BB) is again another fourth topic
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swu3
10/7/2012 1:52 PM EDT
I think the thesis is right.
It is just shocking how badly Intel missed this SOC trend. Too much focus on raw transistor performance versus what mattered for making a low power SOC. Intel pushed both chips design and silicon technology is the right direction for high performance CPUs but not for low cost low power mobile SOCs. 5 years from now when Wintel falls, the lack so SOC focus will be the reason understood given for Intel blowing its near 2 decade cash printing monopoly position.
TSMC, Apple, Samsung, Arm are perhaps the 4 best positioned companies.
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sranje
10/7/2012 10:23 PM EDT
Perhaps, to keep things in a perspective, ARM annual run rate revenues are ~~$800M
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resistion
10/12/2012 10:11 PM EDT
I think only 10 nm atom may allow soc breakout against 28 nm but not 20 nm arm soc. Finfet doesn't benefit soc integration, just x86 CPU.
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