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Design Article

LED performance boosted by wireless bonding

Jonathan Domingo, Lumex

10/26/2012 5:42 AM EDT

The future of wireless bonded LED technology
The applications that will benefit the most from wireless bonded LED technology are ones that specifically require superior heat dissipation, enhanced durability and superior light performance.

These applications include:
•    High-power or high-brightness applications such as general lighting, white goods, and automotive that require superior heat dissipation.
•    Performance-sensitive applications such as plastic sorting, security applications, precision medical applications and agricultural process that require enhanced durability and consistent performance.
•    Visually sensitive applications such as grain sorting, industrial measurements and small space lighting that require bright, evenly distributed, shadowless light.


Figure 3: Light emission with traditionally bonded LED


Figure 4: In addition to providing greater brightness in reduced space, wireless bonded LEDs provide more consistent, evenly distributed light performance.

As LED technology, particularly high-power LED technology, continues to evolve and become more widely adopted, wireless bonded LED technology provides key benefits to design engineers challenged with providing greater brightness, superior heat dissipation and enhanced durability with increasingly smaller footprints.

About the author
Jonathan Domingo is Product Development Engineer at Lumex. During his seven years of field work in optoelectronics, he has helped design custom LED and LCD solutions for leading brands in industries ranging from appliances to aviation to consumer electronics.

Courtesy of EETimes Europe

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Developing smart LED-based lighting systems

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agk

10/29/2012 6:49 AM EDT

Now it is pic

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agk

10/29/2012 6:53 AM EDT

Now it is picking up momentum even though it is a decade old technology.The advantages mentioned here are really expected from a good LED.Provided that it will not increase the price of the LED.

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docdivakar

11/9/2012 2:17 PM EST

Several drawbacks of this article:

1. Misnomer of calling flipchip as wireless! The latter term is deeply entrenched in mobile communications as is the former term in the chip interconnect industry!! You need to call a spade a spade...

2. Preaching to the choir! Most readers of EE Times are already familiar to flip chip which has been around for decades now. What I would have liked to see is a cross-section of an actual device and not cartoons.

3. Better, quantified data to backup claims made -the authors makes comments about LED arrays but does not show any data to backup. Irrespective of the interconnect method, thermal cross talk between LEDs joined at the substrate is always going to be a problem and I don't see this proven by data.

MP Divakar

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12/13/2012 11:05 PM EST

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anne-francoise.pele

4/12/2013 8:44 AM EDT

Click on the link below to check out the collection of Design Articles, Case Studies, Product How-To articles, Teardowns, etc... that have been published on Smart Energy Designline.

Check back frequently. The list will be updated as new articles arrive.

http://www.eetimes.com/design/smart-energy-design/4371743/LED-Focus

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