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Test & Measurement Design Features

Thermocouple nodules, cold junctions and integration opportunities

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Triangulation in automotive ultrasonic park-assist systems

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Measuring the transition to disaster

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Address jitter and noise more effectively with DDR4, part1

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Electromagnetic Interference (EMI) Pt 2

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Imperas launches multicore software development tools

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Artificial heart ready for human trial

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Slideshow: The making of IBM's nano movie

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Micromirror development tool takes aim at 3-D printing

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MCU functionalities change for ISO 26262 safety standard

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Bell Labs group aims at 90% energy-saving in networks

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Energy Micro adds Cortex-M4 based MCUs

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Infineon, Renesas see sales tumble in industrial ranking

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Multicore debug goes heterogeneous at PMC-Sierra

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Time-of-flight measurements open up user-interaction scenarios

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Electronics in medicine: Insulin pump design

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Intel, Qualcomm pioneer MEMS performance standard

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Students build electric racing car

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Touchstone preps entry into power management

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Slideshow: Inside McLaren's Formula 1 Racing Tech Center

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Tracking down interference in complex RF environments

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Infineon goes to GloFo for embedded flash

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How small vendors compete in analog IC market

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Book excerpt: Agilent’s LTE and the Evolution to 4G Wireless, part 2

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DESIGN West: Snapdragon CPU comes on pico-ITX board

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Reference Designs

Commentary

Now in its seventh year, ARM TechCon is ranked one of the top three critical events in the embedded sector.

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In celebration of test (one of my favorite topics), take a look at top 10 design articles in the archives.

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Littelfuse's Speed2Design Exploration & Discovery program brings engineers behind-the-scenes at NASA's Ames Research and Johnson Space Centers.

Join  post comment   1 comment    last comment  Max the Magnificent
This sounds like the chance of a lifetime -- I'd already have entered myself, but I'm not allowed to ...
There are eight panels at DAC this year. Which ones should you attend?

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This may sound a little crazy, but I seriously think I may have just had my first conversation with an artificial intelligence.

Join  post comment   16 comments    last comment  Max the Magnificent
Interesting...

Recent Comments

Good Intentions. But honestly I doubt the outcomes. Atleast its good news for NXP/INFN/ST/Atmel ...
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elih66  05.23.2013
Intel's new CEO shakes things up
Let's see, most of the big smartphone companies use version of ARM with some customization, I cannot ...
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Reader Message Boards

What would you put in the next Nintendo Wii?

By rick.merritt on 04.25.2011

Nintendo pioneered the use of motion sensors in its Wii console. The company announced April 25 it will roll out its next-generation console in 2012 and show a

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last comment   10.12.2011  martin.rowe
I bought a Wii last year and have almost no use for it. Computer games are a waste of money and ...

 

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T&M technology coverage
The Test&Measurement Designline is edited by Anne-Françoise Pelé who also edits the EE Times' Military & Aerospace DesignLine, Automotive Designline, Medical DesignLine and Smart Energy Designline.

We welcome submissions of Design Articles, Case Studies, Product How-To articles as well as guest blogs together with news and technical information on new products.

Contact Anne-Francoise Pelé at anne-francoise.pele@ubm.com.

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