Thermocouple nodules, cold junctions and integration opportunities
Triangulation in automotive ultrasonic park-assist systems
Measuring the transition to disaster
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Address jitter and noise more effectively with DDR4, part1
Electromagnetic Interference (EMI) Pt 2
Imperas launches multicore software development tools
Artificial heart ready for human trial
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Slideshow: The making of IBM's nano movie
Micromirror development tool takes aim at 3-D printing
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MCU functionalities change for ISO 26262 safety standard
Bell Labs group aims at 90% energy-saving in networks
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Energy Micro adds Cortex-M4 based MCUs
Infineon, Renesas see sales tumble in industrial ranking
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Multicore debug goes heterogeneous at PMC-Sierra
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Time-of-flight measurements open up user-interaction scenarios
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Electronics in medicine: Insulin pump design
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Intel, Qualcomm pioneer MEMS performance standard
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Students build electric racing car
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Touchstone preps entry into power management
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Slideshow: Inside McLaren's Formula 1 Racing Tech Center
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Tracking down interference in complex RF environments
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Infineon goes to GloFo for embedded flash
How small vendors compete in analog IC market
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Book excerpt: Agilent’s LTE and the Evolution to 4G Wireless, part 2
DESIGN West: Snapdragon CPU comes on pico-ITX board
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