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hm

6/2/2011 1:06 AM EDT

Will they include the future of memory - 3D chips?

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JEDEC mobile memory standard unfolds

Janine Love

5/25/2011 12:59 PM EDT

If you have a vested interest in the next JEDEC memory standard, consider attending one of its Mobile Memory Forum events in June. The events are hosted by the JEDEC Solid State Technology Association and will be held in Shenzhen, China on Monday, June 20; Hsinchu, Taiwan on Wednesday, June 22; and Seoul, Korea on Friday, June 24. The series aims to highlight the latest developments and standards for mobile memory from industry leaders.

The events will focus on four key technologies with major impact potential for the mobile device market: Universal Flash Storage (UFS), LPDDR3, WideIO and solid state drives. For more information, head here.

Which technology would you bet on? Why? Sound off below.




hm

6/2/2011 1:06 AM EDT

Will they include the future of memory - 3D chips?

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