Commentary
Viewpoint: Is TSV for real?
Israel Beinglass
4/9/2012 8:57 PM EDT
Cornerstone of the TSV story
Figure 2: Original story on TSV advantages followed IBM announcement
Figure 2: Original story on TSV advantages followed IBM announcement
Figure 2 is taken from Ignatowski’s presentation made shortly after IBM's TSV announcement. This type of argument where chip stacking is compared to two chips side by side has become the cornerstone of the TSV story.
Already at that point, it was clear to IBM that there were many issues with the technology that needed to be resolved. Figure 3 shows the IBM slide discussing some of the problems for implementing TSV for mass production.
During the years following and through to today there have been many attempts to bring the technology to mass production. All have been without real success.
The professional literature is full of beautiful roadmaps showing how TSV is going to change the industry with "more than Moore" as the next scaling methodology.
Figure 4 is the Advanced Packaging road map for Texas Instruments, which is typical of most company's packaging/TSV roadmaps.
Already at that point, it was clear to IBM that there were many issues with the technology that needed to be resolved. Figure 3 shows the IBM slide discussing some of the problems for implementing TSV for mass production.
Figure 3: Issues per IBM with the TSV technology
During the years following and through to today there have been many attempts to bring the technology to mass production. All have been without real success.
The professional literature is full of beautiful roadmaps showing how TSV is going to change the industry with "more than Moore" as the next scaling methodology.
Figure 4 is the Advanced Packaging road map for Texas Instruments, which is typical of most company's packaging/TSV roadmaps.
Figure 4: TI Packaging Technology Trends Dec 2011
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