Startup Kandou Bus has a novel technique for packing more bits down a wire. Getting the world to adopt a new communications coding scheme is not easy, although the company is gaining traction at Jedec and the Optical Internetworking Forum.
While those efforts percolate, Kandou engineers implemented a way to use its technology to speed up connections between die in a multi-chip module (below). The approach packs 20.83 Gbits/s/wire across 12mm for an efficiency rating of 0.94 pJ/bit.
At least one big company is said to be adopting the approach in a product that could ship next year. Perhaps that’s what’s putting a smile on the faces of Kandou engineers Chrisoph Walter and Anant Singh (above).
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