Foundry start-up 1st Silicon (Malaysia) Sdn. Bhd. has announced a strategy that is expectedto bring Malaysia its first large-scale wafer fab.
1st Silicon announced it has entered into a technology alliance with Japan's Sharp Corp.
and has also secured a syndicated loan of more than $200 million from a consortium of European banks.
Sharp will transfer its 0.25-micron process technology to 1st Silicon, which is constructing
an 8-in.-wafer processing fab in Kuching, in the Malaysian state of Sarawak. In the
future, Sharp will transfer its 0.18-micron technology to the Malaysian company.
1st Silicon's fab, which will be capable of running 30,000 8-in. wafers a
month, will move into production in the fourth quarter of 2000, according to
Claudio G. Loddo, the company's chief executive.
"With these agreements now in force, 1st Silicon can promise future customers
[an] independent semiconductor manufacturing facility [with] leading-edge
technologies," Loddo said in a statement.