SUNNYVALE, Calif. -- In a move to expand customer support without expanding internally, startup LightSpeed Semiconductor Corp. has teamed with Tekmos Inc., naming the ASIC engineering firm as an authorized design center for its Module Based Arrays.
Because of competitive pressures requiring shortened design cycles, many companies need additional engineering support to complete their designs quickly, said David Lautzenheiser, vice president of marketing at LightSpeed, Sunnyvale, Calif.
"The relationship we have developed with Tekmos as an authorized design center allows us to offer our customers highly tuned engineering resources and experience to rapidly implement their design into our Module Based Arrays," he said.
Tekmos, based in Austin, Tex., is an engineering services provider specializing in ASIC- and PLD-based designs for the telecommunications, industrial, and consumer sectors. Under the deal announced today, the company will take designs from customers in a variety of formats and completely implement them in LightSpeed's Module Based Array technology.
LightSpeed's devices are targeted at moderate-volume designs for communications, computing, and industrial markets that require ASIC performance and price, with production flexibility normally associated with programmable logic. The Module Based Arrays architecture integrates components that enable rapid design and debug, eliminate test vector development, and enable two- to three-week turns on production-ready parts, according to LightSpeed.