SAN FRANCISCO -- Intel Corp. has developed a new heat sink and fan to dissipate more than 50% more heat from more powerful processors, the Intel Developers Forum was told this week.
Louis Burns, vice president and co-general manager of the Intel Desktop Platforms group, said the firm will work with external vendors, as it traditionally does, to bring the radically new heat sink and fan to market.
He told EBN that the new devices will dissipate 83 watts, compared with 52 watts for a 2-GHz Pentium 4 or 55 watts for a 2.2-Ghz P4 with existing heat sink and fans.
The much higher heat dissipating devices are aimed at the growing smaller desktop PC form factor market. Burns said it is not intended for the mobile or server markets, which have their own specialized heat sinks and fans.
The new heat sink uses a circular pattern of fins with the blades slightly bent at their end. A copper core is included for the first time at the center of the circular array to conduct away heat with even higher efficiency.
The new heat sink is used in conjunction with a new fan that pulls air in from all sides, instead of straight down as in current designs. The air is then ejected in a similar spreading pattern at the bottom of the heat sink for even greater thermal efficiency, Burns added.
The new fan itself runs at the same acoustic 35 db noise level as existing fans, a demand of PC makers, the Intel executive said.
Intel also developed a new reference design for a more efficient power supply for new generation higher performance processors. Burns said the new unit occupies no more space than existing power supplies, yet has three times the output at 6-to-9 watts per cubic inch. Although not available on the market yet, Intel expects power supply vendors to develop units shortly using its reference design.