Plexus Corp. is expanding its engineering services. Two weeks ago, the Neenah, Wis., EMS company completed a development and evaluation platform for Texas Instruments Inc.'s TNETV3010 silicon. The deal will help the Dallas-based chipmaker and its customers use high-density carrier-class voice-over-packet (VoP) gateways.
"It's great to get in on the ground floor with new TI technology," said Todd Kelsey, Plexus' director of operations. "From an engineering standpoint, it positions Plexus to be a key developer of future products that use TI technology."
Prior to the platform contract, Plexus did not have a product development relationship with TI and wanted to build on its manufacturing ties with the chipmaker.
"The platform design allowed our team to significantly reduce the time required to verify the TNETV3010 silicon and will assist our customers in developing and evaluating their TNETV3010 silicon-based voice applications," said Irvind S. Ghai, TI's high-density-voice manager, in a statement.
Besides the TI contract, Plexus in February forged a licensing agreement to use San Jose-based Tessera Technologies Inc.'s chip-scale packaging (CSP) and multichip packaging solutions. The deal enables Plexus to develop and make miniaturized electronic devices.
"We can design and manufacture products using Tessera technology," Kelsey said. "It's relevant to some of our targeted industries such as the medical sector, which has implantable devices such as pacemakers. This puts us in a different light with medical OEMs. It's also good for handheld devices that can be used for communications or computing."
Tessera will also provide Plexus with design collaboration, technology support and transfer, and sales and marketing assistance.