EAST FISHKILL, N.Y.-- IBM Microelectronics today brought its $2.5 billion 300mm-wafer fab unit onstream as part of a $5 billion capital investment program launched two years ago to expand its chip making sites worldwide.
The fab will utilize a host of advanced process technologies, including low-k dielectrics, silicon germanium, and copper interconnects, and is part of a plan by IBM to create a broad-based manufacturing hub in upper New York state.
The fab's opening follows a July 18 initiative by International Sematech and the State University of New York at Albany to develop a new Sematech branch in the Hudson Valley region to develop next-generation lithography processes. Dubbed International Sematech North, the program will represent a $320 million investment by both parties and include a five-year project aimed at developing an extreme ultraviolet (EUV) lithography infrastructure.
According to Richard Doherty, an analyst for The Envisioneering Group, Seaford, N.Y., IBM's 300mm-wafer fab and the Sematech initiative will draw talent from the surrounding area.
"From MIT to Princeton in N.J., the Hudson Valley offers a greater number of educated and talented engineers per thousand than anywhere else in the world," Doherty said. "The Hudson Valley offers everything except earthquakes."