InCirT Technology here has announced the addition of a
ball grid array (BGA) processing to its contract manufacturing capabilities.
"BGA is a breakthrough packaging concept and a powerful technology
engine that is propelling the market forward," said Mehrdad Mobbaseri,
president of InCirT Technology, a division on Pen Interconnect Inc., of Salt
The cost-effectiveness of BGA-populated assemblies is also having a
significant industry impact, he added. "Combined with the pressures of
quicker time to market and shorter product life cycles, the packaging
technology makes domestic contract manufacturers a highly favorable
resource to North American customers compared to overseas sources."
BGA packaging breaks the 208-pin barrier and allows printed circuit
boards to accommodate more than 1,000 input/outputs for greater system
performance and efficiency of configuration. It also provides better electrical
performance, higher density, and faster dvelopment time.
"New body sizes in single-board BGAs are very inexpensive to
develop--about $8,000 to $10,000--and deliverable in a few weeks," said
Mobbaseri. "This compares with about $1 million to $1.5 million and 8 to
12 months for leadframe technologies."