BURNABY, British Columbia -- PMC-Sierra Inc today announced its entry into the wireless-infrastructure chip market with the launch of a new series of digital signal processor ICs aimed at power amplifier architectures for third-generation wireless networks.
The company said the PM7800 Palandin-10 chip allows traffic over all major digital 3G standards to be transmitted through new digitally-controlled power amplifier architectures. PMC-Sierra said the DSP-based chip eliminates transmitter distortion and improves spectral efficiency in 3G wireless networks.
"The Internet and wireless technologies are converging to form an entirely new communications platform," said Kevin Huscroft, who is acting vice president and general manager of PMC-Sierra's Wireless Products Division. "Capitalizing on the opportunities will require a new architecture for an entirely new generation of equipment designed to handle wideband data that is built on a foundation of flexible and highly adaptable digital signal processing techniques," added Huscroft, who is the company's chief technology officer.
Huscroft said Paladin-10 is the "first of many new PMC-Sierra products that will enable this new wireless infrastructure equipment deployment."
According to PMC-Sierra, the Paladin device--power amplifier linearizer and distortion inhibitor--is the industry's first off-the-shelf chip solution that eliminates transmitter distortions and improves spectral efficiency in base transceiver stations. The company claimed that its DSP-based device will provide system makers with the lowest cost per watt solution.
The chip uses an advanced feature set, which will enable existing analog amplifier designs to be transformed into multi-carrier capable, digitally-controlled wideband power amplifiers, said PMC-Sierra. These higher data rates and increased call capacity are needed for 3G wireless services, the company added.
To minimize distortion, interference and noise, the Paladin-10 chip and control software eliminate analog related problems, such as wideband group delay, thermal and envelope memory dependencies, and bulk AM-AM (amplitude-amplitude modulation) and AM-PM (amplitude-phase modulation) transistor effects. These effects can cause in-channel distortion and adjacent channel interference.
The PM7800 Paladin-10 CMOS device operates with a power dissipation of 1.4 watt, and it is available in a 31-by-31-mm (304-pin) SBGA package. PMC-Sierra said the chip is priced at $320 each in volume quantities and samples will become available in the first quarter of 2001.