Hynix Semiconductor Inc. plans to open a 300mm-wafer pilot line in the fourth quarter of this year with initial production starting one quarter later.
Farhad Tabrizi, Hynix vice president of worldwide marketing, said the Korean chipmaker will equip a fab shell in Chongju for the new 300mm wafer operation.
He said the 300mm fab will begin production using 100-nanometer (0.1-micron) process technology. The first chips in the new fab will be 512 Megabit DDR memory, and in Q2 '04 production will expand to 1 Gigabyte DDR, the Hynix official added.
Hynix will start 1Gbyte production earlier in an existing 200mm fab, planning samples in Q3 '03 and production in Q4 '03, according to Tabrizi.