WARREN, N.J. - Anadigics Inc. has signed a joint development agreement on silicon germanium with Atmel Corp. subsidiary Temic Semiconductors Inc. (Heilbronn, Germany), the second SiGe deal the German company has inked in as many weeks. On Aug. 24, Temic joined hands with AMP Inc. subsidiary M/A-COM Inc. (Lowell, Mass.) to jointly design and manufacture SiGe ICs for RF/IF telecommunications applications.
The deals signify both the growing importance of SiGe as a process alternative to BiCMOS and gallium arsenide in high-frequency communications and a desire by Temic to assemble a roster of partners to rival SiGe leader IBM Microelectronics.
Temic began research in SiGe in the early 1990s, and has a 6-inch SiGe wafer fab in Heilbronn. The company offers SiGe RF chips for Digital European Cordless Telephone applications, as well as power amplifiers for GSM telephones.
Anadigics and Temic will share process information about SiGe, as well as design information about RF ICs designed in the process. Temic's agreement with M/A-COM calls for the actual joint design and manufacture of SiGe products supporting wireless telephony, wireless LANs and wireless local loops.