SEOUL, South Korea Leading board makers here are preparing to launch advanced production capabilities that focus on a handful of pc-board products, including IC packages and memory modules destined for Rambus DRAMs.
Pc-board makers such as Daeduck Electronics Co., Samsung Electro-Mechanics Co., LG Electronics, Korea Circuit System Co. and Simmtech Co. expect their IC package and memory module businesses to thrive in 2000 as they introduce and commercialize new high-end pc-board production capabilities.
Daeduck said it will focus on an ink-laser production method and photo via technique as it gears up Rambus DRAM production in 2000. The company also said it is developing base technology for testing the reliability of Rambus DRAM board modules. In addition, it expects to begin volume production of multichip scale package (CSP) boards, which are seen by manufacturers as an emerging technology for board production.
Key techniques for 2000
Samsung will begin production at its Pusan facility of multilayer pc boards and also plans to launch production of double-sided ball-grid array (BGA) boards. Samsung teamed with U.S. manufacturer AlliedSignal to develop the technique. It also plans to use an ink-laser production method along with wafer-level CSP production.
In 2000 LG plans to develop a multiple micro-BGA board in cooperation with Tessera Inc. Along with wafer-level CSP work, it also plans to obtain production licensing for Rambus DRAM module boards.
Korea Circuit System said it intends in 2000 to begin the development of BGA board production technology.
Simmtech also is targeting Rambus DRAM production in 2000. The company plans to concentrate on next-level module board technology for Rambus DRAMs, and it aims to launch a new CSP board production technique, company officials said. Exclusive to EE Times by Chom Dan Inc. (Seoul, South Korea).