Los Angeles - ASIP Inc. last week demonstrated its first indium phosphide electroabsorption modulated lasers packaged in the popular transmitter optical subassemblies for XFP and Xenpak transceivers.
The Somerset, N.J.-based company-which has offered lasers at 1,310 nm and 1,550 nm in bare-die form but never in subassembly packages-showed its lasers here at the Optical Fiber Communications Conference.
ASIP's III-V fabrication methods do not rely on special-materials selective-regrowth, but on advanced photolithography and etching methods, said chief executive officer Mike Decelle.
The two EML lasers offered in transmitter optical subassemblies packages include the uncooled 1,310-nm laser, with performance superior to a direct-modulated laser at distances up to 6.2 miles; and the 1,550-nm semi-cooled laser, operating at 50 degrees C with 1-dB dispersion penalty, the company said. The latter laser is used in topologies out to nearly 50 miles.