MANHASSET, N.Y. Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc., San Jose, has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp., Japan.
Sharp uses Tessera's technology to package many types of semiconductor devices, such as Flash memory and Flash and SRAM stacked
combinations, both markets in which Sharp is considered an industry leader, as well as application integrated circuits (ASICs) and logic devices. Sharp incorporates these semiconductors into consumer products, including personal digital assistants, digital
still cameras, video cameras and mobile handsets.
The packaging technology available to Sharp under the expanded agreement covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices in face-down, face-up, fold-over, stacked, and system-in-package (SiP) formats. The packages are based on either tape or laminate substrates.
"Tessera is pleased to have reached an agreement that has much broader license terms with Sharp, a company broadly recognized as a leading packaging innovator. As a result of this agreement, we are increasing Tessera's penetration in the consumer electronics market," said Kirk Flatow, Tessera's senior vice president, marketing and
sales, in a statement.