MANHASSET, N.Y. Fujitsu Ltd. and Staccato Communications Inc. have announced a partnership under which they will provide all-CMOS, single-chip wireless universal serial bus (USB) and ultra-wideband (UWB) solutions for the global marketplace.
Both companies will leverage the partnership to deliver value-added, next-generation wireless USB/UWB technology-based solutions that comply with Multiband OFDM Alliance (MBOA) UWB specifications. Sampling of these chips is scheduled for 2005.
Fujitsu (Tokyo) will offer its SoC/ASSP together with UWB products from Staccato (San Diego) as part of its next-generation wireless USB/UWB technology-based solutions, enabling customers to develop state-of-the-art products with wireless USB capabilities.
"Perhaps one of the best decisions we have made at Staccato was our choice of Fujitsu's process technology," said Roberto Aiello, founder and chief technology officer of Staccato Communications, in a statement. "For digital-centric designs like wireless USB, Fujitsu's process technologies and a rich set of libraries and IPs have tremendous advantages, and the real benefit is in how well Fujitsu's process technology and libraries are optimized to handle high-speed RF circuit designs embedded along with the digital."
Last month, Staccato demonstrated the industry's first single-chip, all-CMOS ultrawideband radio complying with the Multiband-OFDM Alliance's physical-layer specifications.