MANHASSET, N.Y. Nextreme Thermal Solutions has secured $8 million in Series A financing to commercialize its thermoelectric material for semiconductor applications.
The $8 million, funded by investment firms SpaceVest, Aurora Funds, Harris & Harris Group Inc., and RTI International, will be used to develop thermoelectric devices to address semiconductor thermal management problems and further develop the application base, including power generation and optical communications.
A spin-off of RTI International, Nextreme (Research Triangle Park, N.C.), developed the thin-film superlattice thermoelectric material as an outgrowth of research with the U.S. Dept. of Defense. The Office of Naval Research and the Defense Advance Research Projects Agency (DARPA) have funded the company's materials and devices since 1993.
Placed under a semiconductor hot spot, Nextreme's material can efficiently pump heat out of the semiconductor package. Because of its form factor, the material can be directly integrated onto the semiconductor or into the chip package, thus providing an unobtrusive solid state cooling solution with no moving parts.
Nextreme is led by former RTI entrepreneur Jesko von Windheim, a former co-founder of MEMS company Cronos Integrated Microsystems.