MANHASSET, N.Y. Tessera Technologies Inc. said Tuesday (March 1) it has filed a patent infringement suit against Infineon Technologies AG and Micron Technology Inc., charging the companies infringed upon Tessera's IP for packages used to house memory and other semiconductor devices.
The suit, filed in the U.S. District Court for the Eastern District of Texas, revolves around packages used for dynamic random access memory (DRAM) devices, confirmed Doug Norby, senior vice president and chief financial officer for Tessera.
Tessera (San Jose, Calif.) had last November settled a patent suit with Samsung Electronics Co. Ltd. of Korea involving multi-chip packages. Tessera licenses its packaging IP to major semiconductor suppliers.
In the past, Tessera has also tangled with Texas Instruments Inc.(Dallas, Tx.) and Sharp Electronics Corp. of Japan in packaging IP disputes.