MANHASSET, N.Y. Amkor Technology Inc. said the U.S. International Trade Commission has remanded Amkor's patent suit against rival packaging supplier Carsem to an administrative law judge for further investigation of Amkor's claims that Carsem infringed patents related to its quad flat pack, no-lead package technology.
According to Amkor (Chandler, Ariz.), the ITC has clarified Amkor's patent claims, paving the way for the judge to issue new findings and conduct a complete investigation. The probe is expected to be completed by Nov. 21.
Last November, the ITC judge ruled that Carsem had infringed Amkor's patents related to its MicroLeadFrame package technology. Amkor originally filed a patent infringement complaint against Carsem with the ITC in December 2003.
However, the November 2004 decision did not find that Carsem had committed a statutory violation of the Tariff Act, which would have banned the company from importing the infringing parts into the U.S. Amkor then filed a petition to have the ITC review the judge's decision.
In February, the ITC granted Amkor's request to review its patent-infringement claims
"We are pleased that the Commission has provided the [judge] with a definitive clarification as to the meaning of our patent claims and believe that this will have a positive effect on our case against Carsem," John Boruch, Amkor's president and chief operating officer, said in a statement.
"We believe that this action by the Commission will strengthen our infringement claims against Carsem, and we are optimistic that the validity of our patents will withstand judicial review."