LONDON Suss MicroTec AG has developed a nano-imprint lithography tool. The NPS300 NanoPatterning Stepper was developed within the Sixth Framework Program in cooperation with the VTT Microelectronics Center during a one-year project.
The European Commission initiated a four year project on nano-patterning methods called NaPa in March 2004, which Suss is taking part in, the company said.
The NPS300 achieves a sub-20-nm imprinting resolution for cold (UV-NIL) and hot embossing applications and is available either as a manually loaded machine or as a fully automated system with wafer loading capability. When equipped with the automatic alignment option, the NPS300 demonstrates a 250-nm overlay accuracy and accepts stamps with sizes up to 100-mm and with thickness' up to 6.5-mm. The NPS300 imprinting arm can be equipped with either a cold or a hot embossing head. The imprinting force ranges from 5N to 4kN. The active area of the stamp can be up to 40-mm by 40-mm for UV-NIL and 100-mm by 100-mm for hot embossing.
"The NPS300 offers various imprinting techniques," said Gilbert Lecarpentier, strategic product manager for the NPS300, in a statement. "Step and stamp imprinting for hot embossing is an innovative method that has been demonstrated by VTT Microelectronic Centre in Finland with a FC150 device bonder. This imprint lithography method consists of transferring the pattern of the stamp into a thermoplastic embossing material by controlling heat and pressure. Ideal for performing all process steps required for different imprint lithography technologies, this new tool is a cost-effective alternative to high-resolution e-beam lithography for printing sub-20-nm geometries. Using in-situ material dispense and UV curing, the step and cure Imprinting method is also achieved with the NPS for cold embossing applications."