MANHASSET, N.Y. Hynix Semiconductor Inc., NanoAmp Solutions Inc., and Winbond Electronics Corp. have joined the CellularRAM work group, an organization creating common specifications for high-performance pseudo-SRAM (PSRAM) devices for future 2.5G and 3G handset designs.
The new members join Cypress Semiconductor Corp., Infineon Technologies, and Micron Technology Inc., and other semiconductor suppliers in the group.
The CellularRAM work group has developed three generations of specifications for high-bandwidth devices with densities of 16 to 256 megabits. The group is working on a fourth generation specification to further enhance suitability of CellularRAM architecture-based products for high-bandwidth baseband and application processors.
"We are pleased to welcome Hynix, NanoAmp, and Winbond to the CellularRAM work group and look forward to their system expertise and product direction contributions," said the CellularRAM work group in a joint statement. "Through their participation, these companies strengthen our objective to provide customers with a standardized solution that meets multi-sourced, low-power, and high-performance requirements."