SAN JOSE, Calif. IBM Corp. this week reached an out-of-court settlement with the University of Wisconsin over alleged patent infringement in chip manufacturing, according to the Associated Press.
The Wisconsin Alumni Research Foundation had accused IBM in a suit of infringing its technology in making copper-based chips, according to the report. The suit accused IBM of patent infringement in two chips, including the PowerPC 750.
“The patent in question covers a metal barrier that prevents conductive metals from getting into the silicon that stores data in computer chips, stopping them from overheating or malfunctioning,” according to the report. “It was granted in 1986 to John Wiley, an engineering professor who is now the school's chancellor, and his colleague John Perepezko.”
Since discovering widespread use of the patent, the Wisconsin foundation has waged a legal campaign for more than two years. In addition to IBM, Sony, Toshiba, Samsung, and Infineon have settled patent infringement suits with the university.
The foundation continues to negotiate a settlement with Cypress Semiconductor Corp., according to the report.