LONDON Royal Philips Electronics has ramped three 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France.
Philips says one of the parts, a baseband chip for highly integrated System-in-Package (SiP) connectivity devices, is already shipping at volumes of about 1 million a month.
The baseband chip is targeted at SiP’s for applications such as Bluetooth and WLAN.
Philips shares the Crolles 2 facility with ST Microelectronics and Freescale Semiconductor Inc., and the R&D alliance is on target to prototype 65-nm CMOS during 2005.
The company says the fast ramp-up to high volume 90-nm CMOS production means that it will soon begin transfer manufacturing to TSMC. The joint development projects was, from the start, aimed at process
alignment between Philips' and TSMC's 90-nm CMOS process technologies.
Though Philips acknowledges the 90-nm CMOS process is currently used mainly for digital circuits, it stresses options for special functions such as embedded non-volatile memory and RF circuitry are not that far away.
All three companies involved in the Crolles2 Alliance are working on the implementation of Flash/EEPROM
non-volatile memory in 90-nm as well as RFCMOS technologies.