MANHASSET, N.Y. Phoenix-based electronic component supplier White Electronic Designs Corp. has been awarded a $1.9 million contract by an unnamed military subcontractor for System-on-Chip (SOC) Power PC products, which will be used in the latest generation of air-to-air missiles.
"We are pleased to receive this production order in support of a combat proven air-to-air missile," said White Corp. chairman and chief executive in a statement. "Multichip packages or SoCs are viewed as part of the solution for the widening gap between silicon I/O density and the material capabilities of the package and board/substrate. The system designer can customize performance using the most cost-effective silicon solutions from different fabrications all in the same package."
White expects to ship these products over the next 24 months.